S25FL064LABMFM010

S25FL064LABMFM010

Manufacturer No:

S25FL064LABMFM010

Manufacturer:

Infineon Technologies

Description:

IC FLASH 64MBIT SPI/QUAD 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

S25FL064LABMFM010 Specifications

  • Type
    Parameter
  • Clock Frequency
    108 MHz
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    SPI - Quad I/O, QPI
  • Memory Organization
    8M x 8
  • Memory Size
    64Mbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, FL-L
The S25FL064LABMFM010 integrated circuit chip is a high-performance, low-power, and high-density flash memory device offered by Cypress Semiconductor. Some of its advantages and application scenarios include:1. Large Storage: The S25FL064LABMFM010 chip offers a storage capacity of 64 megabits (Mb), which is equivalent to 8 megabytes (MB). This large storage capacity makes it suitable for applications that require ample data storage, such as consumer electronics, network routers, and industrial automation.2. High Performance: The chip provides high-speed read and write operations, allowing for quick access to stored data. It has a maximum clock frequency of 104 MHz, enabling fast data transfer rates, which is advantageous in applications that demand high-speed data processing or real-time operations.3. Low Power Consumption: The chip is designed to minimize power consumption. It incorporates power-saving features like deep power-down mode and standby mode, making it suitable for battery-powered devices or applications that prioritize energy efficiency.4. SPI Interface: The chip interfaces with the host device using a Serial Peripheral Interface (SPI). SPI is a widely used serial protocol that allows for easy integration with various microcontrollers, system-on-chips (SoCs), or embedded systems.5. Extended Temperature Range: The S25FL064LABMFM010 chip is designed to operate reliably over an extended temperature range, typically from -40°C to +85°C. This feature is critical for applications deployed in harsh environments or extreme temperatures, such as automotive electronics, aerospace systems, or industrial control systems.6. Flexible Architecture: The chip supports various erase and program functions, including sector erase, block erase, chip erase, and byte program operations. This flexibility allows designers to optimize the memory layout and tailor it to the specific needs of their applications.Application scenarios for S25FL064LABMFM010 chip:1. Consumer Electronics: The chip can be utilized in devices like smart TVs, set-top boxes, gaming consoles, and digital cameras to provide additional storage for firmware, application code, configuration data, or user data.2. Networking Equipment: Network routers, switches, and gateways often require flash memory to store firmware, boot loaders, or configuration data. The high density and performance of the chip make it suitable for such networking applications.3. Industrial Automation: The chip can be used in industrial control systems, programmable logic controllers (PLCs), or human-machine interfaces (HMIs) to store program code, parameter data, or log files reliably.4. Automotive Electronics: With its extended temperature range and robust design, the chip can serve automotive applications, including infotainment systems, instrument clusters, advanced driver assistance systems (ADAS), or engine control units (ECUs).5. Internet of Things (IoT): The chip can be integrated into IoT devices, such as smart meters, sensors, or wearable devices, to store firmware, sensor data, or configuration settings.Overall, the S25FL064LABMFM010 chip's large storage capacity, high performance, low power consumption, SPI interface, extended temperature range, and flexible architecture make it suitable for a wide range of applications requiring reliable and high-density flash memory.