DS24B33G+T&R
Manufacturer No:
DS24B33G+T&R
Manufacturer:
Description:
IC EEPROM 4KBIT 1-WIRE 2SFN
Datasheet:
Delivery:
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In Stock : 27470
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DS24B33G+T&R Specifications
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TypeParameter
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Supplier Device Package2-SFN (6x6)
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Package / Case2-SFN
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply2.8V ~ 5.25V
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Access Time2 µs
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Write Cycle Time - Word, Page-
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Memory Interface1-Wire®
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Memory Organization256 x 16
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Memory Size4Kbit
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TechnologyEEPROM
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Memory FormatEEPROM
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Memory TypeNon-Volatile
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DigiKey ProgrammableNot Verified
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The DS24B33G+T&R integrated circuit chips, manufactured by Maxim Integrated, offer several advantages and find application in various scenarios. Here are some of the advantages and application scenarios of DS24B33G+T&R chips:1. Small Form Factor: The DS24B33G+T&R chips are designed to be compact, making them suitable for applications where space is limited. Their small form factor allows for easy integration into various electronic devices.2. High-Speed Data Transfer: These chips support high-speed data transfer rates, enabling efficient communication between devices. This makes them ideal for applications that require quick and reliable data exchange, such as industrial automation, data loggers, and sensor networks.3. One-Wire Interface: DS24B33G+T&R chips utilize a one-wire interface, which simplifies the wiring and reduces the number of pins required for communication. This feature makes them suitable for applications where a minimal number of wires or pins are available, such as in embedded systems or IoT devices.4. Low Power Consumption: Maxim Integrated has designed these chips with low power consumption in mind. This makes them suitable for battery-powered devices or applications where energy efficiency is crucial, such as wireless sensor networks or wearable devices.5. Robust Security Features: DS24B33G+T&R chips incorporate robust security features, including a unique 64-bit ROM ID and a 1-Wire cryptographic engine. These features enable secure authentication and protection of data, making them suitable for applications that require secure communication or data storage.Application scenarios for DS24B33G+T&R chips include:1. Temperature Monitoring: These chips can be used in temperature monitoring systems, where they can interface with temperature sensors and provide accurate and reliable temperature readings. This is useful in applications such as environmental monitoring, HVAC systems, and cold chain management.2. Asset Tracking: DS24B33G+T&R chips can be utilized in asset tracking systems, where they can communicate with various sensors and transmit data about the location, condition, or status of assets. This is beneficial in logistics, supply chain management, or fleet tracking applications.3. Industrial Control Systems: These chips can be integrated into industrial control systems, enabling communication and control of various devices and sensors. They can be used in applications such as process automation, equipment monitoring, or building management systems.4. Smart Home Automation: DS24B33G+T&R chips can be employed in smart home automation systems, allowing for communication and control of different devices within a home network. They can be used for tasks such as controlling lighting, monitoring energy consumption, or managing security systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the DS24B33G+T&R chips in a given context.
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