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GD25Q16CTEGR

GD25Q16CTEGR

Manufacturer No:

GD25Q16CTEGR

Description:

IC FLASH 16MBIT SPI/QUAD 8SOP

Datasheet:

Datasheet

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GD25Q16CTEGR Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    8-SOP
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Write Cycle Time - Word, Page
    50µs, 2.4ms
  • Clock Frequency
    120 MHz
  • Memory Interface
    SPI - Quad I/O
  • Memory Organization
    2M x 8
  • Memory Size
    16Mbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Not For New Designs
  • Series
    -
The R1WV3216RBG-7SR#B0 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Density: These chips offer a high memory density of 512Mb (64M x 8 bits), allowing for storage of large amounts of data. 2. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Fast Access Speed: With a synchronous interface, these chips provide fast access times, enabling quick data retrieval and processing. 4. Wide Temperature Range: The chips can operate in a wide temperature range, making them suitable for use in various environments. 5. RoHS Compliant: These chips are compliant with the Restriction of Hazardous Substances (RoHS) directive, ensuring they are environmentally friendly.Application Scenarios: 1. Consumer Electronics: The high memory density and low power consumption make these chips suitable for use in consumer electronics devices like smartphones, tablets, digital cameras, and portable media players. 2. Automotive Systems: The wide temperature range and low power consumption make these chips ideal for automotive applications such as infotainment systems, navigation systems, and advanced driver-assistance systems (ADAS). 3. Industrial Control Systems: These chips can be used in industrial control systems, including factory automation, robotics, and process control, where high memory density and reliable performance are required. 4. Medical Devices: The chips can be used in medical devices like patient monitoring systems, medical imaging equipment, and portable medical devices, where low power consumption and high memory density are crucial. 5. Networking and Communication: These chips can be used in networking and communication equipment such as routers, switches, and network storage devices, where fast access speed and high memory density are essential for data processing and storage.Overall, the R1WV3216RBG-7SR#B0 integrated circuit chips offer high memory density, low power consumption, fast access speed, and wide temperature range, making them suitable for a wide range of applications in various industries.
GD25Q16CTEGR Relevant information