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MT29F256G08EBHAFB16A3WC1-R

MT29F256G08EBHAFB16A3WC1-R

Manufacturer No:

MT29F256G08EBHAFB16A3WC1-R

Manufacturer:

Micron Technology Inc.

Description:

IC FLASH 256GBIT PARALLEL DIE

Datasheet:

Datasheet

Delivery:

Payment:

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MT29F256G08EBHAFB16A3WC1-R Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    Die
  • Package / Case
    Die
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    2.5V ~ 3.6V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    333 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    32G x 8
  • Memory Size
    256Gbit
  • Technology
    FLASH - NAND (TLC)
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MT29F256G08EBHAFB16A3WC1-R is a specific model of NAND flash memory integrated circuit chip manufactured by Micron Technology. Here are some advantages and application scenarios of this chip:Advantages: 1. High Capacity: The chip has a capacity of 256 gigabits (32 gigabytes), allowing for storage of large amounts of data. 2. Fast Read and Write Speeds: It offers fast read and write speeds, enabling quick access to data and efficient data transfer. 3. Reliability: The chip is designed to be highly reliable, with built-in error correction and wear-leveling algorithms to ensure data integrity and longevity. 4. Low Power Consumption: It operates at low power, making it suitable for battery-powered devices and reducing energy consumption. 5. Small Form Factor: The chip is available in a small form factor, making it suitable for compact devices with limited space.Application Scenarios: 1. Solid-State Drives (SSDs): The high capacity and fast read/write speeds of the chip make it suitable for use in SSDs, providing high-performance storage for computers and servers. 2. Mobile Devices: The low power consumption and small form factor make it ideal for use in smartphones, tablets, and other portable devices, providing storage for apps, media files, and user data. 3. Industrial Applications: The chip's reliability and high capacity make it suitable for use in industrial applications such as embedded systems, IoT devices, and automotive electronics, where data storage and reliability are crucial. 4. Consumer Electronics: It can be used in various consumer electronics devices like digital cameras, gaming consoles, and media players, providing storage for photos, videos, games, and other multimedia content. 5. Networking and Data Storage: The chip can be used in networking equipment, routers, and data storage systems, providing high-capacity storage for network configurations, firmware, and data logging.It's important to note that the specific application scenarios may vary depending on the requirements and specifications of the devices or systems in which the chip is integrated.
MT29F256G08EBHAFB16A3WC1-R Relevant information