MT48LC16M16A2P-7E L:D

MT48LC16M16A2P-7E L:D

Manufacturer No:

MT48LC16M16A2P-7E L:D

Manufacturer:

Micron Technology Inc.

Description:

IC DRAM 256MBIT PAR 54TSOP II

Datasheet:

Datasheet

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MT48LC16M16A2P-7E L:D Specifications

  • Type
    Parameter
  • Supplier Device Package
    54-TSOP II
  • Package / Case
    54-TSOP (0.400", 10.16mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3V ~ 3.6V
  • Access Time
    5.4 ns
  • Write Cycle Time - Word, Page
    14ns
  • Clock Frequency
    133 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    16M x 16
  • Memory Size
    256Mbit
  • Technology
    SDRAM
  • Memory Format
    DRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The MT48LC16M16A2P-7E L:D integrated circuit chips have several advantages and application scenarios:Advantages: 1. High density: The chips have a capacity of 256 Megabits (16M x 16) which allows for storing a large amount of data. 2. High speed: They operate at a clock frequency of 143 MHz, enabling fast data transfer and processing. 3. Low power consumption: The chips are designed to operate on low power, making them suitable for battery-powered devices or energy-efficient systems. 4. Easy integration: The chips are integrated circuits, meaning they can be easily connected and used in various electronic systems or devices. 5. Extended temperature range: They can operate in a wide temperature range, typically -40°C to +85°C, making them suitable for applications in extreme environments. 6. High reliability: The chips are designed with high-quality materials and manufacturing processes, ensuring their reliability and durability.Application scenarios: 1. Memory modules: The chips can be used as memory modules in computers, servers, or other electronic devices that require high-density and high-speed memory. 2. Networking equipment: They are suitable for use in routers, switches, and other networking equipment as cache memory or for buffering data. 3. Telecommunication systems: These chips can be employed in telecommunication systems for storing and processing data or for buffering purposes. 4. Consumer electronics: They can be used in various consumer electronic devices, such as smartphones, tablets, or gaming consoles, to provide high-speed and reliable memory storage. 5. Industrial control systems: The chips can be utilized in industrial control systems that require high-density and reliable memory for data storage or processing. 6. Automotive applications: They can be employed in automotive systems, including infotainment systems or engine control units, to enable fast data access and storage.Please note that the specific application scenarios may vary depending on the system requirements and design considerations.