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SI5335D-B04217-GMR

SI5335D-B04217-GMR

Manufacturer No:

SI5335D-B04217-GMR

Manufacturer:

Skyworks Solutions Inc.

Description:

IC 4OUT ANY FREQ <200MHZ 24QFN

Datasheet:

Datasheet

Delivery:

Payment:

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SI5335D-B04217-GMR Specifications

  • Type
    Parameter
  • Packaging
    Tape & Reel (TR)
The BU2630F is a specific integrated circuit (IC) chip manufactured by Rohm Semiconductor. While I couldn't find specific information about this particular chip, I can provide you with general advantages and application scenarios of IC chips.Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Reliability: IC chips are less prone to failure due to their compact design, reduced interconnection points, and improved manufacturing processes. 3. Power efficiency: IC chips are designed to operate at lower power levels, resulting in energy-efficient devices. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Performance: IC chips can offer improved performance, such as faster processing speeds, higher memory capacities, and enhanced functionality.Application scenarios of IC chips: 1. Consumer electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices. 2. Automotive industry: IC chips are employed in various automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and sensors. 3. Industrial automation: IC chips find applications in industrial control systems, robotics, motor drives, sensors, and communication modules. 4. Medical devices: IC chips are used in medical equipment like pacemakers, blood glucose monitors, imaging systems, and diagnostic devices. 5. Internet of Things (IoT): IC chips play a crucial role in IoT devices, enabling connectivity, data processing, and control in smart homes, wearables, industrial monitoring systems, and more.It's important to note that the specific advantages and application scenarios of the BU2630F chip may vary depending on its intended purpose and specifications. For detailed information about this chip, it is recommended to refer to the manufacturer's datasheet or technical documentation.
SI5335D-B04217-GMR Relevant information