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23S09-1HPGG

23S09-1HPGG

Manufacturer No:

23S09-1HPGG

Description:

IC ZD BUFFER 16TSSOP

Datasheet:

Datasheet

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23S09-1HPGG Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3V ~ 3.6V
  • Divider/Multiplier
    No/No
  • Frequency - Max
    133MHz
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:9
  • Number of Circuits
    1
  • Output
    CMOS, LVTTL
  • Input
    LVTTL
  • PLL
    Yes with Bypass
  • Type
    Zero Delay Buffer
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The P3I2005AG-08SR integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The P3I2005AG-08SR chips offer high-performance capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 3. Compact Size: The integrated circuit chips are compact in size, allowing for easy integration into various electronic devices. 4. Wide Operating Temperature Range: The P3I2005AG-08SR chips can operate in a wide temperature range, making them suitable for both industrial and consumer applications. 5. Robust and Reliable: These chips are designed to be robust and reliable, ensuring stable operation even in harsh environments.Application Scenarios: 1. Internet of Things (IoT): The P3I2005AG-08SR chips can be used in IoT devices, enabling connectivity and data processing capabilities. 2. Industrial Automation: These chips can be utilized in industrial automation systems for control and monitoring purposes. 3. Consumer Electronics: The P3I2005AG-08SR chips can be integrated into various consumer electronic devices such as smartphones, tablets, and wearables, enhancing their performance and functionality. 4. Automotive Electronics: These chips can be used in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). 5. Medical Devices: The P3I2005AG-08SR chips can be employed in medical devices, such as patient monitoring systems and diagnostic equipment, due to their high performance and reliability.It is important to note that the specific advantages and application scenarios may vary depending on the exact specifications and features of the P3I2005AG-08SR integrated circuit chips.
23S09-1HPGG Relevant information