SI5350C-B07670-GT
Manufacturer No:
SI5350C-B07670-GT
Manufacturer:
Description:
IC ANY FREQ ANY OUT REF C 10MSOP
Datasheet:
Delivery:
Payment:
In Stock : 0
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SI5350C-B07670-GT Specifications
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TypeParameter
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Supplier Device Package10-MSOP
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Package / Case10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-
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Voltage - Supply-
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Divider/Multiplier-
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Frequency - Max-
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Differential - Input:Output-
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Ratio - Input:Output-
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Output-
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Input-
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PLL-
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Type-
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DigiKey ProgrammableNot Verified
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PackagingTube
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Product StatusActive
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Series-
The CY2412SXC-3T integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices or energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for easy integration into space-constrained designs. 3. High performance: Despite their small size, these chips offer high-performance capabilities, enabling efficient data processing and communication. 4. Versatility: The chips support various communication protocols, making them suitable for a wide range of applications. 5. Cost-effective: The chips are designed to be cost-effective, providing a cost-efficient solution for many applications.Application Scenarios: 1. Internet of Things (IoT): The CY2412SXC-3T chips can be used in IoT devices for wireless communication, enabling connectivity and data exchange between devices. 2. Wearable devices: These chips can be integrated into wearable devices such as smartwatches or fitness trackers, enabling wireless connectivity and data transmission. 3. Home automation: The chips can be used in home automation systems to enable wireless communication between different devices, allowing for remote control and monitoring. 4. Industrial automation: These chips can be utilized in industrial automation systems for wireless communication between sensors, actuators, and control systems, enabling efficient data exchange and control. 5. Smart grid: The chips can be employed in smart grid systems for wireless communication between power distribution devices, enabling efficient monitoring and control of electricity distribution.Overall, the CY2412SXC-3T integrated circuit chips offer low power consumption, small form factor, high performance, versatility, and cost-effectiveness, making them suitable for various applications in IoT, wearable devices, home automation, industrial automation, and smart grid systems.
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