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CY23FP12OXC-003

CY23FP12OXC-003

Manufacturer No:

CY23FP12OXC-003

Description:

IC FANOUT BUFFER 28SSOP

Datasheet:

Datasheet

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Payment:

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CY23FP12OXC-003 Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SSOP
  • Package / Case
    28-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    2.5V, 3.3V
  • Divider/Multiplier
    Yes/No
  • Frequency - Max
    200MHz
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    2:12
  • Number of Circuits
    1
  • Output
    LVCMOS
  • Input
    LVCMOS, LVTTL
  • PLL
    Yes
  • Type
    Fanout Buffer (Distribution), Zero Delay Buffer
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The 8N4QV01KG-2002CDI8 is a specific integrated circuit (IC) chip manufactured by IDT (Integrated Device Technology). While I couldn't find detailed information about this specific chip, I can provide you with general advantages and application scenarios of IC chips.Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Reliability: IC chips are less prone to failure due to their compact design, reduced interconnection points, and improved manufacturing processes. 3. Power efficiency: IC chips are designed to consume less power, making them suitable for battery-powered devices and energy-efficient applications. 4. Cost-effective: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Performance: IC chips can offer high-speed operation, improved signal processing capabilities, and advanced features due to advancements in semiconductor technology.Application scenarios of IC chips: 1. Consumer electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices. 2. Automotive industry: IC chips are employed in various automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and more. 3. Industrial automation: IC chips are used in industrial control systems, robotics, sensors, and other automation applications to enhance efficiency and productivity. 4. Communication systems: IC chips are crucial components in networking equipment, wireless communication devices, satellite systems, and telecommunications infrastructure. 5. Medical devices: IC chips are utilized in medical imaging equipment, patient monitoring systems, implantable devices, and other medical applications. 6. Aerospace and defense: IC chips are employed in avionics, radar systems, navigation systems, communication systems, and other defense-related applications.It's important to note that the specific advantages and application scenarios of the 8N4QV01KG-2002CDI8 chip may vary based on its intended purpose and specifications. For detailed information about this chip, it is recommended to refer to the datasheet or technical documentation provided by the manufacturer.
CY23FP12OXC-003 Relevant information