2308-1HDCG

2308-1HDCG

Manufacturer No:

2308-1HDCG

Description:

IC MULT ZDB 16SOIC

Datasheet:

Datasheet

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2308-1HDCG Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3V ~ 3.6V
  • Divider/Multiplier
    No/No
  • Frequency - Max
    133.3MHz
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:8
  • Number of Circuits
    1
  • Output
    LVTTL
  • Input
    LVTTL
  • PLL
    Yes with Bypass
  • Type
    Multiplier, Zero Delay Buffer
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The 2308-1HDCG integrated circuit chips have several advantages and application scenarios:Advantages: 1. High integration: The 2308-1HDCG chips are highly integrated, which means they can perform multiple functions in a single chip. This reduces the need for additional components and simplifies the overall circuit design. 2. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Small form factor: The compact size of the 2308-1HDCG chips makes them suitable for applications with space constraints, such as portable devices or miniaturized electronic systems. 4. Cost-effective: Due to their high integration and low power consumption, these chips offer a cost-effective solution for various applications.Application scenarios: 1. Consumer electronics: The 2308-1HDCG chips can be used in various consumer electronic devices, such as smartphones, tablets, digital cameras, or portable media players. They can perform functions like audio/video processing, power management, or connectivity. 2. Internet of Things (IoT): These chips can be utilized in IoT devices, including smart home appliances, wearables, or industrial sensors. They can enable connectivity, data processing, and control functions in these devices. 3. Automotive electronics: The 2308-1HDCG chips can find applications in automotive electronics, such as infotainment systems, advanced driver-assistance systems (ADAS), or engine control units. They can provide processing power, connectivity, and control capabilities in these systems. 4. Industrial automation: These chips can be used in industrial automation systems, including programmable logic controllers (PLCs), robotics, or machine vision systems. They can enable control, communication, and data processing functions in these applications. 5. Medical devices: The 2308-1HDCG chips can be employed in medical devices like patient monitoring systems, diagnostic equipment, or implantable devices. They can provide processing power, connectivity, and data management capabilities in these devices.Overall, the 2308-1HDCG integrated circuit chips offer high integration, low power consumption, and cost-effectiveness, making them suitable for a wide range of applications in various industries.