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CY2304SXI-2

CY2304SXI-2

Manufacturer No:

CY2304SXI-2

Manufacturer:

Infineon Technologies

Description:

IC FANOUT BUFFER 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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CY2304SXI-2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Divider/Multiplier
    Yes/Yes
  • Frequency - Max
    133.3MHz
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:4
  • Number of Circuits
    1
  • Output
    Clock
  • Input
    Clock
  • PLL
    Yes
  • Type
    Fanout Buffer (Distribution), Zero Delay Buffer
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The BU2630FV is an integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BU2630FV are:Advantages: 1. High integration: The BU2630FV integrates multiple functions into a single chip, reducing the need for external components and simplifying circuit design. 2. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Small form factor: The chip is available in a small package, allowing for compact designs and space-saving in electronic devices. 4. Wide operating voltage range: The BU2630FV can operate within a wide voltage range, making it compatible with various power supply configurations. 5. High reliability: The chip is designed to provide stable and reliable performance, ensuring the longevity and durability of the electronic device it is used in.Application Scenarios: 1. Consumer electronics: The BU2630FV can be used in various consumer electronic devices such as smartphones, tablets, digital cameras, portable media players, etc., where its small form factor and low power consumption are advantageous. 2. Internet of Things (IoT): The chip can be applied in IoT devices like smart home appliances, wearable devices, and sensor nodes, where its low power consumption and high integration are beneficial for efficient and compact designs. 3. Industrial automation: The BU2630FV can be used in industrial automation systems, including control panels, motor drives, and sensors, where its reliability and wide operating voltage range are advantageous. 4. Automotive electronics: The chip can be applied in automotive electronics, such as infotainment systems, dashboard displays, and control modules, where its small form factor and high reliability are beneficial. 5. Medical devices: The BU2630FV can be used in medical devices like patient monitors, portable diagnostic equipment, and wearable health trackers, where its low power consumption and high integration are advantageous for battery-powered and compact designs.These are just a few examples of the advantages and application scenarios of the BU2630FV integrated circuit chip. The specific usage will depend on the requirements and design considerations of the electronic device or system it is being used in.
CY2304SXI-2 Relevant information