DLP3000FQB
Manufacturer No:
DLP3000FQB
Manufacturer:
Description:
IC DIG MICROMIRROR DEV 50LCCC
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In Stock : 0
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DLP3000FQB Specifications
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TypeParameter
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Supplier Device Package50-LCCC
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Package / Case50-CLCC
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Mounting TypeSurface Mount
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Applications3D, Medical Imaging
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TypeDigital Micromirror Device (DMD)
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusObsolete
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Series-
The DLP3000FQB integrated circuit chips, developed by Texas Instruments, are part of the Digital Light Processing (DLP) technology family. These chips offer several advantages and find application in various scenarios. Some of the advantages and application scenarios of DLP3000FQB integrated circuit chips are:Advantages: 1. High resolution: The DLP3000FQB chips provide high-resolution display capabilities, enabling the projection of sharp and detailed images. 2. High brightness: These chips offer high brightness levels, making them suitable for applications where a bright and vibrant display is required. 3. Low power consumption: DLP3000FQB chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 4. Compact size: The chips are compact in size, allowing for integration into small form factor devices and applications. 5. Fast response time: DLP3000FQB chips have a fast response time, enabling smooth and seamless video playback without motion blur.Application scenarios: 1. Portable projectors: The DLP3000FQB chips are commonly used in portable projectors due to their compact size, low power consumption, and high-resolution display capabilities. These chips enable the creation of small and lightweight projectors that can be easily carried and used in various environments. 2. Head-up displays (HUDs): DLP3000FQB chips find application in HUDs, which are used in automotive and aviation industries. These chips provide high-resolution and high-brightness displays, allowing for clear and visible information projection onto the windshield or other surfaces. 3. Augmented reality (AR) devices: DLP3000FQB chips are utilized in AR devices, such as smart glasses and headsets. These chips enable the projection of virtual content onto the user's field of view, providing an immersive AR experience with high resolution and brightness. 4. 3D printing: DLP3000FQB chips are also used in 3D printers that utilize Digital Light Processing technology. These chips enable precise and high-resolution projection of UV light patterns onto a photosensitive resin, facilitating the creation of detailed and accurate 3D printed objects.Overall, the DLP3000FQB integrated circuit chips offer high-resolution, high-brightness, low power consumption, and compact size, making them suitable for various applications such as portable projectors, HUDs, AR devices, and 3D printing.
DLP3000FQB Relevant information
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QN9022/D518
NXP USA Inc. -
QS74FCT4X2245YQATQ3
IDT, Integrated Device Technology Inc -
TCAN4551RGYRQ1
Texas Instruments -
DS28C22Q+T
Analog Devices Inc./Maxim Integrated -
PMB8710FV1.3FL
Lantiq -
SMC6290SC3
Analog Devices Inc. -
671GI-16LF
IDT, Integrated Device Technology Inc -
MAX14657ETE+
Analog Devices Inc./Maxim Integrated -
TFA9887UK/N2062
NXP USA Inc. -
PCF7921ATT/M2AB1200118
NXP USA Inc.