DLP9000XBFLS
Manufacturer No:
DLP9000XBFLS
Manufacturer:
Description:
IC DIG MICROMIRROR DEV 355CLGA
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DLP9000XBFLS Specifications
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TypeParameter
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Supplier Device Package355-CLGA (42.2x42.2)
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Package / Case355-BCLGA
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Mounting TypeSurface Mount
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Applications3D, Medical Imaging
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TypeDigital Micromirror Device (DMD)
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series-
The DLP9000XBFLS integrated circuit chips, developed by Texas Instruments, are digital micromirror device (DMD) chips used in digital light processing (DLP) technology. Here are some advantages and application scenarios of these chips:Advantages: 1. High resolution: The DLP9000XBFLS chips offer a high resolution of up to 2560x1600 pixels, enabling the display of detailed and sharp images. 2. Fast response time: These chips have a fast switching speed, allowing for smooth and seamless video playback without motion blur. 3. High brightness: DLP technology, powered by these chips, can produce high brightness levels, making it suitable for applications where a bright display is required. 4. Scalability: The DLP9000XBFLS chips can be used in combination with other DMD chips to create larger and higher-resolution displays, offering scalability for various applications. 5. Long lifespan: The DMD chips have a long lifespan, ensuring durability and reliability for extended usage.Application scenarios: 1. Projectors: The DLP9000XBFLS chips are commonly used in high-end projectors, enabling them to project high-resolution images with excellent color accuracy and contrast. 2. Digital signage: These chips find applications in digital signage displays, allowing for vibrant and eye-catching visuals in retail stores, airports, stadiums, and other public spaces. 3. Virtual reality (VR) and augmented reality (AR): DLP technology, powered by these chips, can be utilized in VR and AR headsets to provide immersive and high-resolution visual experiences. 4. Medical imaging: The high resolution and fast response time of the DLP9000XBFLS chips make them suitable for medical imaging applications, such as digital X-ray systems and endoscopy devices. 5. 3D printing: DLP-based 3D printers utilize these chips to project precise patterns onto a resin, enabling high-resolution and fast 3D printing processes.Overall, the DLP9000XBFLS integrated circuit chips offer high resolution, fast response time, and scalability, making them suitable for a wide range of applications requiring high-quality and high-brightness displays.
DLP9000XBFLS Relevant information
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QN9022/D518
NXP USA Inc. -
QS74FCT4X2245YQATQ3
IDT, Integrated Device Technology Inc -
TCAN4551RGYRQ1
Texas Instruments -
DS28C22Q+T
Analog Devices Inc./Maxim Integrated -
PMB8710FV1.3FL
Lantiq -
SMC6290SC3
Analog Devices Inc. -
671GI-16LF
IDT, Integrated Device Technology Inc -
MAX14657ETE+
Analog Devices Inc./Maxim Integrated -
TFA9887UK/N2062
NXP USA Inc. -
PCF7921ATT/M2AB1200118
NXP USA Inc.