DLP5532AFYSQ1
Manufacturer No:
DLP5532AFYSQ1
Manufacturer:
Description:
IC DIG MICROMIRROR DEV 149CPGA
Datasheet:
Delivery:
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In Stock : 0
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DLP5532AFYSQ1 Specifications
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TypeParameter
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Supplier Device Package149-CPGA (22.3x32.2)
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Package / Case149-BFCPGA Exposed Pad
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Mounting TypeThrough Hole
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Applications-
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TypeDigital Micromirror Device (DMD)
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series-
The DLP5532AFYSQ1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High resolution: The DLP5532AFYSQ1 chips offer high-resolution display capabilities, making them suitable for applications that require detailed and sharp images. 2. Low power consumption: These chips are designed to consume minimal power, making them energy-efficient and suitable for battery-powered devices. 3. Compact size: The DLP5532AFYSQ1 chips are compact in size, allowing for easy integration into various devices and systems. 4. High reliability: These chips are built with high-quality components and undergo rigorous testing, ensuring their reliability and durability. 5. Flexible interface options: The DLP5532AFYSQ1 chips support various interface options, including HDMI, LVDS, and MIPI, making them versatile and compatible with different devices.Application scenarios: 1. Automotive displays: The DLP5532AFYSQ1 chips can be used in automotive displays, such as infotainment systems and head-up displays, providing high-resolution and vibrant visuals. 2. Industrial displays: These chips are suitable for industrial displays, including control panels and human-machine interfaces, offering clear and detailed visuals for efficient operation. 3. Medical imaging: The high-resolution capabilities of the DLP5532AFYSQ1 chips make them suitable for medical imaging applications, such as ultrasound machines and digital X-ray systems, enabling accurate diagnosis. 4. Consumer electronics: These chips can be used in various consumer electronics devices, such as smartphones, tablets, and gaming consoles, providing high-quality displays for an enhanced user experience. 5. Virtual reality (VR) and augmented reality (AR): The DLP5532AFYSQ1 chips can be utilized in VR and AR headsets, delivering immersive and realistic visuals for an enhanced virtual experience.Overall, the DLP5532AFYSQ1 integrated circuit chips offer high-resolution display capabilities, low power consumption, and compact size, making them suitable for a wide range of applications in automotive, industrial, medical, consumer electronics, and VR/AR industries.
DLP5532AFYSQ1 Relevant information
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QN9022/D518
NXP USA Inc. -
QS74FCT4X2245YQATQ3
IDT, Integrated Device Technology Inc -
TCAN4551RGYRQ1
Texas Instruments -
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Analog Devices Inc./Maxim Integrated -
PMB8710FV1.3FL
Lantiq -
SMC6290SC3
Analog Devices Inc. -
671GI-16LF
IDT, Integrated Device Technology Inc -
MAX14657ETE+
Analog Devices Inc./Maxim Integrated -
TFA9887UK/N2062
NXP USA Inc. -
PCF7921ATT/M2AB1200118
NXP USA Inc.