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74ALVC16836ADGG:11

74ALVC16836ADGG:11

Manufacturer No:

74ALVC16836ADGG:11

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 3.6V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74ALVC16836ADGG:11 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Logic Type
    Universal Bus Driver
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74ALVC
The 74ALVC16836ADGG:11 is a specific integrated circuit chip, but as an AI language model, I don't have real-time access to the latest product information or datasheets. However, I can provide you with some general information about integrated circuit chips.Integrated circuit chips, also known as ICs or microchips, are widely used in various electronic devices. They offer several advantages, including:1. Miniaturization: ICs allow for the integration of numerous electronic components onto a single chip, reducing the size and complexity of electronic devices.2. Increased reliability: By integrating multiple components onto a single chip, ICs reduce the number of interconnections, minimizing the risk of loose connections or failures.3. Power efficiency: ICs are designed to operate at lower power levels, resulting in reduced energy consumption and longer battery life for portable devices.4. Cost-effectiveness: Mass production of ICs leads to economies of scale, making them more affordable compared to discrete components.Regarding the specific advantages and application scenarios of the 74ALVC16836ADGG:11 chip, I recommend referring to the datasheet or consulting the manufacturer's documentation. The datasheet typically provides detailed information about the chip's features, electrical characteristics, pin configuration, and recommended applications.
74ALVC16836ADGG:11 Relevant information