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74ALVC16834ADGG,11

74ALVC16834ADGG,11

Manufacturer No:

74ALVC16834ADGG,11

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 3.6V 56TSSOP

Datasheet:

Datasheet

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74ALVC16834ADGG,11 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74ALVC
The 74ALVC16834ADGG,11 is a high-performance, low-power, 16-bit buffer/line driver with 3-state outputs. Some of the advantages and application scenarios of this integrated circuit chip are:1. High Performance: The 74ALVC16834ADGG,11 offers high-speed operation with a maximum frequency of 500 MHz. It has a low propagation delay and input-output capacitance, making it suitable for applications that require fast data transfer.2. Low Power Consumption: This chip is designed to consume low power, which is ideal for applications where power efficiency is crucial. It operates at a wide voltage range, typically between 1.65V to 3.6V.3. 3-State Outputs: The 74ALVC16834ADGG,11 features 3-state outputs, which allows multiple devices to share a common bus line without interfering with each other. This feature is particularly useful in applications where multiple integrated circuits need to communicate in a multi-master bus system.4. Interoperability: This chip has TTL (Transistor-Transistor Logic) compatibility, which means it can interface with both TTL and CMOS logic families. It can be used to bridge the gap between different logic levels and enable communication between systems using different logic technologies.5. Wide Application Range: The 74ALVC16834ADGG,11 can be employed in various application scenarios, including telecommunications, networking, data storage, industrial automation, and automotive electronics. It is commonly used in high-speed data buses, address lines, and general-purpose buffer applications.6. ESD Protection: This IC chip incorporates electrostatic discharge (ESD) protection, which safeguards the circuit against damage from static electricity. This feature ensures its resilience in harsh operating environments, making it suitable for industrial and automotive applications where ESD events are common.It is important to note that the specific advantages and application scenarios of the 74ALVC16834ADGG,11 may vary depending on the specific requirements of the system and the designer's implementation choices.
74ALVC16834ADGG,11 Relevant information