SN74ABT16501DGGR

SN74ABT16501DGGR

Manufacturer No:

SN74ABT16501DGGR

Manufacturer:

Texas Instruments

Description:

IC UNIV BUS TXRX 18BIT 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74ABT16501DGGR Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 64mA
  • Number of Circuits
    18-Bit
  • Logic Type
    Universal Bus Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74ABT
The IS25LP040E-JBLE is a specific model of integrated circuit (IC) chip designed by ISSI (Integrated Silicon Solution Inc.) for use in electronic devices. Some of the advantages and application scenarios of this chip are as follows:1. High Storage Capacity: The IS25LP040E-JBLE is a 4-megabit (4 Mb) NOR flash memory IC. This high storage capacity allows it to store significant amounts of data, making it suitable for applications that require ample storage space.2. High-Speed Read/Write Operations: This IC chip offers fast read and write speeds, allowing for efficient data transfer and retrieval. This makes it suitable for applications that require quick access to stored information, such as embedded systems, consumer electronics, and industrial automation.3. Low Power Consumption: The IS25LP040E-JBLE is designed to operate at a low power voltage range, which helps minimize power consumption. This advantage is particularly beneficial for battery-powered devices, wearable electronics, and energy-efficient applications.4. Small Form Factor: The chip is available in a compact package, making it suitable for devices with limited space for integrated circuits. Its small size allows for easy integration into various electronic devices, including mobile devices, network equipment, and automotive electronics.5. Industry-Standard Interface: The IS25LP040E-JBLE features a standard Serial Peripheral Interface (SPI) for communication with other components. This interface is widely supported by microcontrollers and other integrated circuits, making it applicable to a broad range of system designs.6. Extended Temperature Range: The chip is designed to operate reliably over an extended temperature range (-40°C to +85°C). This feature enables its usage in both industrial and automotive applications that often encounter harsh or extreme temperature conditions.Application scenarios for IS25LP040E-JBLE IC chips include:1. Firmware Storage: The high storage capacity and fast read/write speeds make this chip suitable for storing firmware and boot code in a wide range of electronic devices. These can include routers, set-top boxes, IoT devices, and industrial control systems.2. Data Logging: The chip's large storage capacity and low power consumption enable it to be used in applications that require data logging, such as temperature monitoring devices, smart meters, and data acquisition systems.3. System Configuration and Data Storage: The chip's small form factor and industry-standard interface make it useful for storing configuration settings, calibration data, and other system-specific information in various electronic equipment, including medical devices, automotive systems, and consumer electronics.4. Code Execution: The fast read speeds and small form factor of the chip make it suitable for code execution tasks in microcontrollers or system-on-chip (SoC) designs. This includes applications like firmware updates, program storage, and execution in devices like sensors, smart lighting systems, and control boards.It is important to note that while these advantages and application scenarios are commonly associated with the IS25LP040E-JBLE IC chip, the specific implementation and usage can vary based on the design and requirements of the target electronic device. Therefore, it is always recommended to consult the datasheet and application notes provided by the chip manufacturer for detailed information and guidelines.