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MAX3379EETD+

MAX3379EETD+

Manufacturer No:

MAX3379EETD+

Description:

IC TRANSLATOR UNIDIR 14TDFN

Datasheet:

Datasheet

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MAX3379EETD+ Specifications

  • Type
    Parameter
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Supplier Device Package
    14-TDFN (3x3)
  • Package / Case
    14-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Features
    Power Supply Decoupling, Thermal-Shutdown Protection
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    16Mbps
  • Output Type
    Open Drain, Tri-State
  • Output Signal
    -
  • Input Signal
    -
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The SN74AVCH20T245GR is a specific type of integrated circuit chip that offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of this chip:Advantages: 1. Wide voltage range: The chip supports a wide voltage range, allowing it to operate in different power supply environments. 2. Bidirectional level shifting: It provides bidirectional voltage level shifting, enabling seamless communication between devices operating at different voltage levels. 3. High-speed data transfer: The chip supports high-speed data transfer rates, making it suitable for applications that require fast and efficient data transmission. 4. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices. 5. ESD protection: The chip offers built-in electrostatic discharge (ESD) protection, safeguarding the connected devices from potential damage.Application Scenarios: 1. Interface conversion: The chip can be used to convert voltage levels between different devices, allowing them to communicate effectively even if they operate at different voltage levels. 2. Logic level translation: It can be used to translate logic levels between devices with different voltage requirements, ensuring compatibility and seamless integration. 3. Bus buffering: The chip can act as a buffer between different buses, ensuring signal integrity and preventing data loss or corruption during transmission. 4. Mobile devices: It can be used in mobile phones, tablets, or other portable devices to facilitate communication between components operating at different voltage levels. 5. Industrial automation: The chip can be utilized in industrial automation systems to enable communication between devices with varying voltage requirements, ensuring reliable and efficient operation.These are just a few examples of the advantages and application scenarios of the SN74AVCH20T245GR integrated circuit chip. The specific usage will depend on the requirements of the system or device it is being integrated into.
MAX3379EETD+ Relevant information