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74LVC1T45GF,132

74LVC1T45GF,132

Manufacturer No:

74LVC1T45GF,132

Manufacturer:

Nexperia USA Inc.

Description:

IC TRANSLTR BIDIRECTIONAL 6XSON

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC1T45GF,132 Specifications

  • Type
    Parameter
  • Voltage - VCCB
    1.2 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Supplier Device Package
    6-XSON, SOT891 (1x1)
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Data Rate
    420Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Channels per Circuit
    1
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVC
The SN74GTLP1395DWG4 is an integrated circuit chip from Texas Instruments. It is a low-voltage differential signaling (LVDS) repeater specifically designed for high-speed signal transmissions. Here are some advantages and application scenarios of the SN74GTLP1395DWG4 chip:Advantages: 1. High-speed data transmission: The chip supports data rates up to 4.25 Gbps, making it suitable for applications requiring fast and reliable data communication. 2. Low power consumption: It operates at a supply voltage as low as 2.375V, helping to reduce power consumption in devices that incorporate this chip. 3. Low jitter and noise: The chip is designed to minimize signal integrity issues such as jitter and noise, ensuring the reliable transmission of data. 4. Compact package: The chip comes in a compact surface-mount package, allowing for easy integration into circuit boards.Application Scenarios: 1. High-speed data communication: The SN74GTLP1395DWG4 is commonly used in high-speed communication systems, such as Ethernet, USB 3.0, or PCI Express, where data needs to be transmitted at high speeds. 2. Clock distribution: The chip can be used for distributing clock signals in applications that require precise and synchronized timing, such as telecommunications equipment or high-speed switching systems. 3. Data transmission over long distances: LVDS technology, supported by this chip, is known for its ability to transmit data over long distances while maintaining signal integrity. Therefore, this chip can be used in applications where data needs to be transmitted over long cables, such as video surveillance systems or industrial automation. 4. Intra-board or inter-board communications: The chip can be used to interface between different integrated circuits or subsystems on a circuit board, facilitating high-speed data exchange on the board or between different boards.It is important to note that the specific application of the SN74GTLP1395DWG4 chip may vary depending on the requirements of the system or device it is being used in. Therefore, it is advisable to refer to the chip's datasheet and consult with an electronics engineer for detailed application-specific guidance.
74LVC1T45GF,132 Relevant information