In Stock : 0
Please send RFQ , we will respond immediately.
![](/static/public/images/kenko_Certif02.png)
![](/static/public/images/kenko_Certif07.png)
![](/static/public/images/kenko_Certif03.png)
![](/static/public/images/kenko_Certif04.png)
![](/static/public/images/kenko_Certif08.png)
![](/static/public/images/kenko_Certif10.png)
![](/static/public/images/kenko_Certif09.png)
![](/static/public/images/kenko_Certif05.png)
![](/static/public/images/kenko_Certif06.png)
MC10H601FNR2G Specifications
-
TypeParameter
-
Supplier Device Package28-PLCC (11.51x11.51)
-
Package / Case28-LCC (J-Lead)
-
Mounting TypeSurface Mount
-
Features-
-
Operating Temperature0°C ~ 85°C (TA)
-
Data Rate-
-
Output TypeTri-State, Non-Inverted
-
Output SignalTTL
-
Input SignalECL
-
Channels per Circuit9
-
Number of Circuits1
-
Channel TypeUnidirectional
-
Translator TypeMixed Signal
-
PackagingBulk
-
PackagingTape & Reel (TR)
-
Product StatusObsolete
-
Series10H
The GTLP18T612MEA integrated circuit chip has several advantages and can be used in various application scenarios:1. High-speed data transmission: The chip supports high-speed data transmission with a low propagation delay, making it suitable for applications requiring fast and accurate data transfer, such as telecommunications and networking equipment.2. Low-voltage operation: The chip operates at low voltage levels, which helps in reducing power consumption. This feature makes it ideal for portable devices like smartphones, tablets, and wearable gadgets.3. EMI suppression: The chip provides excellent Electro-Magnetic Interference (EMI) suppression capabilities, reducing the noise caused by high-speed data signals. This makes it suitable for applications where EMI can cause disruptions or signal degradation, such as in high-speed data buses or PCB designs.4. Multiple output configurations: The chip offers multiple output configurations, including differential outputs, which allow flexible connectivity options. It can be used in various applications requiring differential signal transmission, such as high-speed serial links and audio/video interfaces.5. Robust design: The chip is designed to operate in harsh environments with high noise susceptibility. It offers a high tolerance for voltage fluctuations, ensuring reliable performance in challenging conditions. This makes it suitable for industrial automation, automotive electronics, and other rugged applications.Application scenarios for GTLP18T612MEA integrated circuit chips include:1. Networking equipment: The chip can be used in high-speed routers, switches, and network interface cards, enabling fast and reliable data transmission.2. Data storage systems: It can be utilized in high-speed storage devices like solid-state drives (SSDs) or RAID arrays, ensuring quick and error-free data transfer.3. High-speed serial links: The chip can be employed in applications requiring high-speed serial links, such as HDMI or DisplayPort interfaces, enabling high-definition audio/video transmission.4. Automotive electronics: It can be used in automotive applications that involve high-speed data communication, like infotainment systems, cameras, or advanced driver-assistance systems (ADAS).5. Industrial automation: The chip can be applied in industrial control systems, robotics, or machine vision applications, where high-speed data transmission and noise immunity are crucial for reliable operation.Overall, the GTLP18T612MEA integrated circuit chips provide advantages like high-speed data transmission, low-voltage operation, EMI suppression, multiple output configurations, and robust design, making them versatile components suitable for various applications.
MC10H601FNR2G Relevant information
-
NL3X5004MU2TAG
onsemi -
NL3X5004DR2G
onsemi -
NL3X5004DTR2G
onsemi -
V62/22604-01XE
Texas Instruments -
NCA9701GXX
Nexperia USA Inc. -
MAX14591ETA+
Analog Devices Inc./Maxim Integrated -
SN74AVCA164245DGG
Texas Instruments -
74AVC1T45DBVR
Texas Instruments -
74AVC1T45DEAR
Texas Instruments -
SN74LVC1T45DCKR-P
Texas Instruments