MC100ES60T22EJ
Manufacturer No:
MC100ES60T22EJ
Manufacturer:
Description:
IC TRANSLATOR UNIDIR 8TSSOP
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MC100ES60T22EJ Specifications
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TypeParameter
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Supplier Device Package8-TSSOP
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Package / Case8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
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Mounting TypeSurface Mount
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Features-
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Operating Temperature-40°C ~ 85°C (TA)
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Data Rate-
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Output TypeDifferential
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Output SignalLVPECL
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Input SignalLVCMOS, LVTTL
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Channels per Circuit2
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Number of Circuits1
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Channel TypeUnidirectional
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Translator TypeMixed Signal
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PackagingTube
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Product StatusObsolete
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Series100ES
The 74GTLPH1627DGGRE4 is a specific model of integrated circuit (IC) chip designed and manufactured by Texas Instruments. It is a bus transceiver device that operates with GTLP (Gunning Transceiver Logic Plus) signaling levels. Here are some of the advantages and application scenarios of this IC chip:Advantages: 1. High-speed data transmission: The 74GTLPH1627DGGRE4 supports high-speed data transmission with low power consumption, making it suitable for applications requiring efficient communication.2. GTLP compatibility: GTLP logic offers superior performance, higher noise immunity, and balanced voltage swings compared to traditional TTL (Transistor-Transistor Logic) or CMOS (Complementary Metal-Oxide-Semiconductor) logic families.3. High drive strength: This IC chip has strong output drive capability, enabling it to transmit and receive signals over longer distances without signal degradation.4. Signal conditioning and level translation: The chip provides signal conditioning and level translation, facilitating seamless communication between systems operating at different voltage levels.Application Scenarios: 1. Communication systems: The 74GTLPH1627DGGRE4 is commonly used in communication systems such as data centers, networking equipment, and telecommunications infrastructure to transmit high-speed signals between different sections of the system.2. Interfacing different logic families: It is used as an interface between different logic families operating at different voltage levels, ensuring compatibility and seamless data exchange.3. Backplane systems: Backplane systems require high-speed, low-power transceivers to enable communication between various modules. The 74GTLPH1627DGGRE4 is suitable for such applications.4. Test and measurement equipment: This IC chip may be used in test and measurement equipment that requires high-speed signal acquisition and transmission while ensuring accurate data integrity.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of the overall system in which the IC chip is utilized.
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