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FXM2IC102L8X_F113

FXM2IC102L8X_F113

Manufacturer No:

FXM2IC102L8X_F113

Manufacturer:

onsemi

Description:

IC TRANSLATOR BIDIR 8MICROPAK

Datasheet:

Datasheet

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FXM2IC102L8X_F113 Specifications

  • Type
    Parameter
  • Package / Case
    8-UFQFN
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    40MHz
  • Output Type
    Open Drain, Tri-State
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.65 V ~ 5.5 V
  • Channels per Circuit
    2
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The SN74GTLPH16916GR is a specific integrated circuit (IC) chip designed for high-speed, low-power digital signaling applications. Its advantages and application scenarios include:1. Low power consumption: The SN74GTLPH16916GR chip is designed with low power circuitry, making it ideal for applications where power efficiency is crucial.2. High-speed operation: This IC chip is capable of handling high-speed digital signals, making it suitable for applications that require fast data transmission.3. Signal integrity: The SN74GTLPH16916GR chip incorporates features to ensure signal integrity, such as advanced equalization techniques and built-in termination resistors. This helps in maintaining the signal quality and reducing signal distortions.4. Small form factor: The integrated circuit is packaged in a small form factor, allowing for space-efficient design implementations.5. Wide voltage range: This chip supports a wide range of power supply voltages from 1.2V to 3.6V, making it compatible with various systems and devices.Application scenarios of SN74GTLPH16916GR chip can include:1. High-speed communication systems: The chip can be used in communication systems where high-speed data transmission is required, such as networking equipment and data centers.2. High-speed buses: It can be used to interface with high-speed buses like PCIe, SAS, or SATA, enabling fast data transfer between different components in a computer or storage system.3. Consumer electronics: The chip can be utilized in various consumer electronic devices like smartphones, tablets, and gaming consoles, allowing for efficient and reliable signal transmission.4. Industrial automation: In industrial automation systems, where high-speed communication is crucial for real-time data processing, the chip can be used for reliable and fast data exchange between different devices and controllers.5. Automotive applications: The SN74GTLPH16916GR chip's low power consumption and high-speed operation make it suitable for automotive applications, such as in-vehicle networking or infotainment systems, where high-speed data transfer and low power usage are essential.Overall, the SN74GTLPH16916GR integrated circuit chip finds utility in scenarios requiring low power consumption, high-speed operation, signal integrity, and small form factor design.
FXM2IC102L8X_F113 Relevant information