74LVXC3245TTR
Manufacturer No:
74LVXC3245TTR
Manufacturer:
Description:
IC TRNSLTR BIDIRECTIONAL 24TSSOP
Datasheet:
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In Stock : 0
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74LVXC3245TTR Specifications
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TypeParameter
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Supplier Device Package24-TSSOP
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Package / Case24-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Features-
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Operating Temperature-55°C ~ 125°C (TA)
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Data Rate-
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Output TypeTri-State, Non-Inverted
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Output Signal-
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Input Signal-
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Voltage - VCCB2.7 V ~ 5.5 V
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Voltage - VCCA2.7 V ~ 3.6 V
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Channels per Circuit8
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Number of Circuits1
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Channel TypeBidirectional
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Translator TypeVoltage Level
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series74LVXC
The SN74GTLPH16916VR is a specific integrated circuit chip designed for high-speed, low-voltage differential signaling (LVDS) applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed data transmission: The SN74GTLPH16916VR chip supports data rates up to 1.6 Gbps, making it suitable for high-speed communication applications. 2. Low power consumption: It operates at low voltage levels (typically 1.8V), resulting in lower power consumption compared to other signaling technologies. 3. Noise immunity: LVDS signaling provides excellent noise immunity, allowing for reliable data transmission even in noisy environments. 4. Small form factor: The chip comes in a compact package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The SN74GTLPH16916VR chip is commonly used in applications that require high-speed data transmission, such as high-speed serial links, data storage systems, and networking equipment. 2. Display interfaces: It can be used in display interfaces like LCD panels, where high-speed data transmission is required to drive the display. 3. Industrial automation: LVDS technology is often used in industrial automation systems for transmitting data between sensors, actuators, and control units. 4. Automotive applications: The chip can be used in automotive systems for high-speed data communication between various components, such as infotainment systems, cameras, and sensors.It's important to note that the specific advantages and application scenarios may vary depending on the requirements of the system and the overall design considerations.
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