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NLSX3013BFCT1G

NLSX3013BFCT1G

Manufacturer No:

NLSX3013BFCT1G

Manufacturer:

onsemi

Description:

IC TRANSLATOR BIDIR 20FLIPCHIP

Datasheet:

Datasheet

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NLSX3013BFCT1G Specifications

  • Type
    Parameter
  • Voltage - VCCB
    1.3 V ~ 4.5 V
  • Voltage - VCCA
    0.9 V ~ 4.5 V
  • Supplier Device Package
    20-FlipChip (2.54x2.03)
  • Package / Case
    20-WFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    100Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Channels per Circuit
    8
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The GTLP16616MTD is a specific integrated circuit chip that belongs to the GTLP family of devices. It is a 16-bit low voltage differential signaling (LVDS) transceiver with flow-through pinout, designed for high-speed data transmission. Here are some advantages and application scenarios of the GTLP16616MTD:Advantages: 1. High-speed data transmission: The GTLP16616MTD supports data rates up to 1.6 Gbps, making it suitable for applications requiring fast and reliable data transfer. 2. Low voltage operation: It operates at low voltage levels, typically around 1.8V, which helps in reducing power consumption and heat dissipation. 3. LVDS signaling: The chip utilizes LVDS signaling, which provides high noise immunity, low power consumption, and excellent signal integrity over long distances. 4. Flow-through pinout: The flow-through pinout simplifies PCB layout and enables easy cascading of multiple devices, reducing the complexity of the overall system design.Application scenarios: 1. High-speed data communication: The GTLP16616MTD can be used in applications that require high-speed data transmission, such as high-speed networking, telecommunications, and data storage systems. 2. Backplane interconnects: It can be employed in systems that utilize backplane architectures, where multiple boards or modules need to communicate with each other at high speeds. 3. Test and measurement equipment: The chip can be utilized in test and measurement instruments that require accurate and fast data acquisition and analysis. 4. Video and image processing: The GTLP16616MTD can be used in video and image processing systems, where high-speed data transfer is crucial for real-time video streaming, image rendering, and other multimedia applications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system design.
NLSX3013BFCT1G Relevant information