74AVCB164245GRG4
Manufacturer No:
74AVCB164245GRG4
Manufacturer:
Description:
IC TRANSLATOR BIDIR 48TSSOP
Datasheet:
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74AVCB164245GRG4 Specifications
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TypeParameter
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Voltage - VCCB1.4 V ~ 3.6 V
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Voltage - VCCA1.4 V ~ 3.6 V
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Supplier Device Package48-TSSOP
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Package / Case48-TFSOP (0.240", 6.10mm Width)
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Mounting TypeSurface Mount
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Features-
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Operating Temperature-40°C ~ 85°C (TA)
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Data Rate-
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Output TypeTri-State, Non-Inverted
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Output Signal-
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Input Signal-
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Channels per Circuit8
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Number of Circuits2
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Channel TypeBidirectional
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Translator TypeVoltage Level
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PackagingTape & Reel (TR)
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Product StatusDiscontinued at Digi-Key
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Series74AVCB
The MC74LVXC3245DTRG is a type of integrated circuit chip known as a bus transceiver. It is designed for bidirectional data transfer between different voltage levels, making it useful in various scenarios. Some advantages and application scenarios of the MC74LVXC3245DTRG are:1. Voltage level translation: The chip can convert logic signals between different voltage levels, enabling communication between devices with different voltage requirements. This is particularly useful in mixed voltage systems, where components with different voltage levels need to interface with each other.2. Bidirectional communication: The MC74LVXC3245DTRG supports bidirectional data transfer, allowing data to flow in both directions simultaneously. This makes it suitable for scenarios that involve communication between different parts of a system, such as connecting a microcontroller to memory chips or peripheral devices.3. High-speed operation: With a maximum operating frequency of typically 100MHz, the chip is capable of handling high-speed data transfer. This makes it suitable for applications that require fast and efficient communication between different components.4. ESD protection: The MC74LVXC3245DTRG provides ESD (Electrostatic Discharge) protection, helping to prevent damage to the chip during handling or operation. This feature is important in scenarios where there is a risk of electrostatic discharge, such as in industrial environments or during assembly and testing processes.5. Industry-standard packaging: The chip is packaged in a small and industry-standard TSSOP package, making it easy to integrate into various electronic systems. The package is surface mountable, allowing for automated assembly processes.Potential application scenarios for the MC74LVXC3245DTRG include:- Interfacing between different voltage domains in mixed voltage systems, such as connecting a 3.3V microcontroller to a 5V memory chip or peripheral device. - Level shifting in communication buses, where signals need to be translated between different voltage levels for proper communication. - Data transfer between different components in a system, such as between a microcontroller and various sensors or actuators. - Implementation of bidirectional communication interfaces between different subsystems or modules within an electronic system. - Use in high-speed data transfer applications, such as in data acquisition systems, industrial automation, or communication equipment.
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