SY10H602JZ TR
Manufacturer No:
SY10H602JZ TR
Manufacturer:
Description:
IC TRANSLATOR UNIDIR 28PLCC
Datasheet:
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SY10H602JZ TR Specifications
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TypeParameter
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Supplier Device Package28-PLCC (11.48x11.48)
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Package / Case28-LCC (J-Lead)
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Mounting TypeSurface Mount
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Features-
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Operating Temperature0°C ~ 85°C (TA)
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Data Rate-
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Output TypeNon-Inverted
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Output SignalECL
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Input SignalTTL
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Channels per Circuit9
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Number of Circuits1
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Channel TypeUnidirectional
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Translator TypeMixed Signal
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series10H
The 74SSTL16837ADGGRE4 is a specific integrated circuit (IC) chip, but as an AI language model, I don't have access to real-time information about specific products released after my last training data in March 2023. Therefore, I cannot provide you with the specific advantages and application scenarios of the 74SSTL16837ADGGRE4 chip.However, in general, IC chips like the 74SSTL16837ADGGRE4 are designed for specific purposes and can offer various advantages depending on their specifications and features. Some common advantages of IC chips include:1. Integration: IC chips often integrate multiple functions or components into a single package, reducing the need for external components and simplifying circuit design.2. Size and Space Efficiency: IC chips are compact and can be manufactured in small sizes, making them suitable for applications where space is limited.3. Power Efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices or energy-efficient applications.4. Speed and Performance: IC chips can provide high-speed operation and improved performance compared to discrete components, enabling faster data processing and improved system performance.As for application scenarios, IC chips are used in a wide range of electronic devices and systems, including computers, smartphones, televisions, automotive electronics, medical devices, industrial control systems, and many more. The specific application scenarios for the 74SSTL16837ADGGRE4 chip would depend on its intended purpose and specifications, which can be found in the chip's datasheet or product documentation provided by the manufacturer.
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