In Stock : 0
Please send RFQ , we will respond immediately.
![](/static/public/images/kenko_Certif02.png)
![](/static/public/images/kenko_Certif07.png)
![](/static/public/images/kenko_Certif03.png)
![](/static/public/images/kenko_Certif04.png)
![](/static/public/images/kenko_Certif08.png)
![](/static/public/images/kenko_Certif10.png)
![](/static/public/images/kenko_Certif09.png)
![](/static/public/images/kenko_Certif05.png)
![](/static/public/images/kenko_Certif06.png)
MC100H606FN Specifications
-
TypeParameter
-
Supplier Device Package28-PLCC (11.51x11.51)
-
Package / Case28-LCC (J-Lead)
-
Mounting TypeSurface Mount
-
Features-
-
Operating Temperature0°C ~ 85°C (TA)
-
Data Rate-
-
Output TypeDifferential
-
Output SignalPECL
-
Input SignalTTL
-
Channels per Circuit6
-
Number of Circuits1
-
Channel TypeUnidirectional
-
Translator TypeMixed Signal
-
PackagingTube
-
Product StatusObsolete
-
Series100H
The SN74AVC20T245DGG integrated circuit chips have several advantages and application scenarios:Advantages: 1. Voltage level translation: The chips provide voltage level translation functionality, allowing bidirectional voltage translation between different voltage domains. This makes them suitable for interfacing different logic families or devices operating at different voltage levels. 2. High-speed data transfer: They are designed to support high-speed data transfer rates, making them ideal for applications that require fast and reliable communication between different subsystems or devices. 3. Low-power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 4. ESD and latch-up protection: They provide built-in electrostatic discharge (ESD) protection and latch-up performance, ensuring robustness and reliability in harsh electrical environments.Application scenarios: 1. Communication interfaces: The chips can be used in various communication interfaces, such as UART, I2C, SPI, or USB, where voltage level translation is required between different subsystems or devices. 2. Mixed voltage system integration: They are suitable for systems that have different voltage domains and need to interface or communicate with each other, such as in mobile devices, IoT applications, or embedded systems. 3. Level shifting in automotive electronics: The chips can be used in automotive electronics systems, where different voltage level requirements, such as 5V and 3.3V, need to be translated while maintaining signal integrity and noise immunity. 4. Microcontroller or FPGA interfacing: They are commonly used to interface microcontrollers or programmable logic devices (such as FPGAs) operating at different voltage levels, ensuring seamless communication and compatibility between these devices.Overall, the SN74AVC20T245DGG integrated circuit chips offer voltage level translation with high-speed data transfer, low power consumption, and protection features, making them versatile for a wide range of applications involving different voltage domains and communication interfaces.
MC100H606FN Relevant information
-
NL3X5004MU2TAG
onsemi -
NL3X5004DR2G
onsemi -
NL3X5004DTR2G
onsemi -
V62/22604-01XE
Texas Instruments -
NCA9701GXX
Nexperia USA Inc. -
MAX14591ETA+
Analog Devices Inc./Maxim Integrated -
SN74AVCA164245DGG
Texas Instruments -
74AVC1T45DBVR
Texas Instruments -
74AVC1T45DEAR
Texas Instruments -
SN74LVC1T45DCKR-P
Texas Instruments