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SY10ELT22LZI TR

SY10ELT22LZI TR

Manufacturer No:

SY10ELT22LZI TR

Manufacturer:

Microchip Technology

Description:

IC TRANSLTR UNIDIRECTIONAL 8SOIC

Datasheet:

Datasheet

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SY10ELT22LZI TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    -
  • Output Type
    Differential
  • Output Signal
    PECL
  • Input Signal
    TTL
  • Channels per Circuit
    2
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Mixed Signal
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    10ELT
The 74AVCB164245GRDR integrated circuit chip is a high-speed, low-power, 16-bit bus transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-Speed Operation: The chip supports data transfer rates of up to 260 Mbps, making it suitable for high-bandwidth applications. 2. Low-Power Consumption: It operates at a low power supply voltage and has low quiescent current, making it energy-efficient. 3. 3-State Outputs: The 3-state outputs of the chip allow a bidirectional data flow and enable multiple devices to share the same bus. 4. ESD Protection: The chip is designed with built-in electrostatic discharge (ESD) protection, ensuring robustness and reliability in various environments.Application Scenarios: 1. Data Communication Systems: The chip can be used in data communication systems where high-speed transmission between devices is required, such as Ethernet switches, routers, and network interface cards. 2. Industrial Automation: It is suitable for industrial automation applications where communication between different modules or devices is needed, such as programmable logic controllers (PLCs) and motor control systems. 3. Memory Interfaces: The chip can be used as a bus transceiver in memory subsystems, providing efficient data transfer between memory modules and the processor. 4. FPGA and ASIC Interfacing: It is commonly used for interfacing Field-Programmable Gate Arrays (FPGAs) and Application-Specific Integrated Circuits (ASICs) in digital systems, allowing data exchange between these components. 5. Bus Protocols: The chip can be employed in various bus protocols, such as I2C, SPI, or CAN, providing bidirectional data transfer between microcontrollers or other devices using these protocols. 6. Automotive Electronics: It can also find applications in the automotive industry, where it may be used for bus communications, interface bridging, or general-purpose data transfer within vehicles.Note that the specific application scenarios may vary depending on the system requirements and design considerations.
SY10ELT22LZI TR Relevant information