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ADG3304BCBZ-REEL

ADG3304BCBZ-REEL

Manufacturer No:

ADG3304BCBZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC TRNSLTR BIDIRECTIONAL 12WLCSP

Datasheet:

Datasheet

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ADG3304BCBZ-REEL Specifications

  • Type
    Parameter
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.15 V ~ 5.5 V
  • Supplier Device Package
    12-WLCSP (2.01x1.61)
  • Package / Case
    12-UFBGA, WLCSP
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    50Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The 74LVXC3245TTR is a 32-bit bus transceiver integrated circuit chip. Some of its advantages and application scenarios are as follows:Advantages: 1. Bidirectional data transfer: The chip allows bidirectional data transfer between two buses with different voltage levels, making it suitable for interfacing between systems operating at different voltage levels. 2. Voltage level translation: It can translate signals between different voltage levels, enabling communication between devices operating at different voltage domains. 3. High-speed operation: The chip supports high-speed data transfer, making it suitable for applications requiring fast data transmission. 4. Low power consumption: It is designed to operate at low power, making it energy-efficient and suitable for battery-powered devices. 5. ESD protection: The chip provides Electrostatic Discharge (ESD) protection, safeguarding the connected devices from damage due to electrostatic discharge events.Application scenarios: 1. Interfacing between different voltage domains: The chip can be used to interface between microcontrollers, FPGAs, or other digital devices operating at different voltage levels. 2. Level shifting: It can be used to shift logic levels between different voltage domains, allowing communication between devices with incompatible voltage levels. 3. Bus transceiver: The chip can be used as a bidirectional buffer for data buses, enabling data transfer between different subsystems or modules. 4. Mixed voltage systems: It is suitable for applications where different parts of a system operate at different voltage levels, such as mixed voltage I/O interfaces or communication buses. 5. Portable devices: The low power consumption and ESD protection make it suitable for use in portable devices like smartphones, tablets, or wearable devices.It is important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.
ADG3304BCBZ-REEL Relevant information