In Stock : 0
Please send RFQ , we will respond immediately.
![](/static/public/images/kenko_Certif02.png)
![](/static/public/images/kenko_Certif07.png)
![](/static/public/images/kenko_Certif03.png)
![](/static/public/images/kenko_Certif04.png)
![](/static/public/images/kenko_Certif08.png)
![](/static/public/images/kenko_Certif10.png)
![](/static/public/images/kenko_Certif09.png)
![](/static/public/images/kenko_Certif05.png)
![](/static/public/images/kenko_Certif06.png)
MC10ELT25DG Specifications
-
TypeParameter
-
Supplier Device Package8-SOIC
-
Package / Case8-SOIC (0.154", 3.90mm Width)
-
Mounting TypeSurface Mount
-
Features-
-
Operating Temperature-40°C ~ 85°C (TA)
-
Data Rate-
-
Output TypeNon-Inverted
-
Output SignalTTL
-
Input SignalECL
-
Channels per Circuit1
-
Number of Circuits1
-
Channel TypeUnidirectional
-
Translator TypeMixed Signal
-
PackagingTube
-
Product StatusObsolete
-
Series10ELT
The MAX3390EEUD+ is a low-voltage, high-frequency, bidirectional level translator integrated circuit chip. Some of the advantages and application scenarios of this chip are:1. Wide voltage translation range: The MAX3390EEUD+ can translate signals between two different voltage levels, with input high levels ranging from 1.2V to 5.5V and output high levels ranging from 1.65V to 5.5V. This makes it versatile and compatible with a wide range of voltage levels.2. High data rate: The chip supports high data rates, making it suitable for applications requiring fast data transfer rates, such as data communication and digital signal processing.3. Bidirectional translation: The MAX3390EEUD+ can translate signals in both directions, making it suitable for applications where data needs to be transmitted bidirectionally, such as I2C, SPI, and UART interfaces.4. Low power consumption: The chip is designed to consume minimal power, making it suitable for battery-powered applications or power-sensitive devices.5. Small form factor: The MAX3390EEUD+ is available in a compact and space-saving package, making it suitable for applications with limited board space.Application scenarios for the MAX3390EEUD+ can include:1. Multilevel logic level translation: The chip can be used to translate signals between different logic levels in mixed-voltage systems, allowing different devices with varying voltage requirements to communicate with each other.2. Interfacing different digital systems: The bidirectional translation capability of the chip makes it ideal for interfacing different digital systems, such as microcontrollers, sensors, and displays, operating at different voltage levels.3. Bus voltage level translation: It can be used for voltage level translation in bus systems, such as I2C, SPI, RS-232, or UART interfaces, where devices with different voltage levels need to communicate.4. Power-efficient devices: The low power consumption of the chip makes it suitable for use in power-constrained devices, such as portable electronics, wearables, and Internet of Things (IoT) devices.Overall, the MAX3390EEUD+ integrated circuit chip offers advantages like wide voltage translation range, high data rates, bidirectional translation, low power consumption, and small footprint, making it applicable in various digital systems and communication interfaces.
MC10ELT25DG Relevant information
-
NL3X5004MU2TAG
onsemi -
NL3X5004DR2G
onsemi -
NL3X5004DTR2G
onsemi -
V62/22604-01XE
Texas Instruments -
NCA9701GXX
Nexperia USA Inc. -
MAX14591ETA+
Analog Devices Inc./Maxim Integrated -
SN74AVCA164245DGG
Texas Instruments -
74AVC1T45DBVR
Texas Instruments -
74AVC1T45DEAR
Texas Instruments -
SN74LVC1T45DCKR-P
Texas Instruments