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HEF4104BP,652

HEF4104BP,652

Manufacturer No:

HEF4104BP,652

Manufacturer:

NXP USA Inc.

Description:

IC TRANSLTR UNIDIRECTIONAL 16DIP

Datasheet:

Datasheet

Delivery:

Payment:

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HEF4104BP,652 Specifications

  • Type
    Parameter
  • Voltage - VCCB
    3 V ~ 15 V
  • Voltage - VCCA
    3 V ~ 15 V
  • Supplier Device Package
    16-DIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    -
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    4000B
The SN74GTL16616DLG4 is a specific integrated circuit chip manufactured by Texas Instruments. It is a 16-bit low-voltage differential signaling (LVDS) transceiver with flow-through pinout. Here are some advantages and application scenarios of this chip:Advantages: 1. Low-voltage differential signaling: LVDS technology provides high-speed data transmission with low power consumption and noise immunity. 2. Flow-through pinout: The flow-through pinout simplifies PCB layout and enables easy cascading of multiple devices. 3. Wide operating voltage range: The chip supports a wide voltage range, typically from 1.65V to 3.6V, making it compatible with various systems. 4. High-speed data transfer: The SN74GTL16616DLG4 supports data rates up to 1.5 Gbps, making it suitable for high-speed communication applications. 5. ESD protection: The chip incorporates built-in electrostatic discharge (ESD) protection, enhancing its robustness and reliability.Application Scenarios: 1. High-speed data communication: The SN74GTL16616DLG4 can be used in applications requiring high-speed data transfer, such as data centers, telecommunications, and networking equipment. 2. Display interfaces: It can be utilized in display interfaces like LCD panels, where high-speed data transmission is necessary for driving the display. 3. Industrial automation: The chip can be employed in industrial automation systems that require reliable and noise-immune communication between different components. 4. Test and measurement equipment: It can be used in test and measurement instruments that require high-speed data acquisition and transmission. 5. Automotive electronics: The chip can find applications in automotive electronics, such as infotainment systems, where high-speed data transfer is required between different modules.It is important to note that the specific application scenarios may vary depending on the system requirements and design considerations.
HEF4104BP,652 Relevant information