SN74GTL16622ADGGR

SN74GTL16622ADGGR

Manufacturer No:

SN74GTL16622ADGGR

Manufacturer:

Texas Instruments

Description:

IC TRANSLATOR BIDIR 64TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

SN74GTL16622ADGGR Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TSSOP
  • Package / Case
    64-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    -
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    GTL
  • Input Signal
    LVTTL
  • Channels per Circuit
    9
  • Number of Circuits
    2
  • Channel Type
    Bidirectional
  • Translator Type
    Mixed Signal
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74GTL
The SN74GTLPH16612DLR is a specific model of integrated circuit chip manufactured by Texas Instruments. It is part of the SN74GTLPH family of dual supply GTLP (Gunning Transceiver Logic Plus) transceivers. Here are the advantages and application scenarios of this chip:Advantages: 1. Dual Supply Voltage: The SN74GTLPH16612DLR supports dual power supply voltage levels, allowing it to operate in systems with different voltage requirements. 2. High-Speed Data Transmission: It is capable of high-speed data transmission, making it suitable for applications that require quick data transfer. 3. Differential Signaling: GTLP transceivers utilize differential signaling techniques, which offer better noise immunity and reduced electromagnetic interference. 4. Low-Voltage Swing: The chip operates with a low voltage swing, which helps in minimizing power consumption and enabling compatibility with low-voltage systems. 5. Flexible I/O Compatibility: The chip has configurable I/O voltage levels, allowing seamless interfacing with various logic families.Application Scenarios: 1. Data Communication Systems: The SN74GTLPH16612DLR can be used in high-speed data communication applications, such as fiber-optic networks, SONET, SDH, or other high-speed serial data transmission systems. 2. Backplane Communication: It can be employed in systems that require reliable and fast communication between different boards or modules, such as enterprise servers, telecom equipment, or high-performance computing systems. 3. Server and Networking Equipment: The chip can play a role in server motherboards, switches, routers, or other network equipment that requires high-speed data transfers and low voltage swing operation. 4. Test and Measurement Instruments: It can be utilized in test and measurement instruments that demand high-speed data acquisition and signal transmission. 5. Storage Systems: The chip can be used in storage systems, including RAID controllers or SAS (Serial Attached SCSI) interfaces, which necessitate high-speed and low-power data transfer.It is important to note that the specific application scenarios can vary depending on the system and requirements of the user. Consulting the chip's datasheet and application notes from Texas Instruments will provide more detailed information about its capabilities and usage.