SN74GTL2006PWR

SN74GTL2006PWR

Manufacturer No:

SN74GTL2006PWR

Manufacturer:

Texas Instruments

Description:

IC TRANSLATOR UNIDIR 28TSSOP

Datasheet:

Datasheet

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SN74GTL2006PWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-TSSOP
  • Package / Case
    28-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    -
  • Output Type
    Open Drain
  • Output Signal
    LVTTL
  • Input Signal
    GTL
  • Channels per Circuit
    13
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Mixed Signal
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74GTL
The SN74LVC4245APWT is a voltage-level translator and bus transceiver integrated circuit chip manufactured by Texas Instruments. It offers various advantages and is suitable for several application scenarios:Advantages: 1. Voltage-level translation: The SN74LVC4245APWT can translate signals between different voltage domains, making it suitable for interfacing devices operating at different voltage levels. 2. Bidirectional communication: It supports bidirectional communication, facilitating data transmission in both directions on a bus. 3. High-speed operation: The chip operates at high speeds, allowing for quick data transfer. 4. Low power consumption: It is designed to consume low power, making it suitable for battery-powered devices. 5. Multiple output-enable controls: The chip features individual output-enable controls for each direction, providing flexibility in data flow control.Application scenarios: 1. Interfacing between different voltage domains: The SN74LVC4245APWT can be used to interface components operating at different voltage levels. For example, it can be used to connect a microcontroller operating at 3.3V to a sensor operating at 5V. 2. Bus communication: The chip is commonly used to enable communication between microcontrollers or other devices on a shared bus, such as I2C or SPI. 3. Level shifting: It can be employed to shift the voltage levels of digital signals, facilitating data exchange between incompatible systems. 4. Mixed-voltage system integration: The chip is suitable for integrating subsystems or modules operating at different voltage levels into a single system. 5. Battery-powered devices: Its low power consumption makes it an excellent choice for applications where power efficiency is critical, particularly in battery-operated devices.It is important to note that the mentioned advantages and application scenarios are generic and may vary depending on specific system requirements and use cases.