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MAX3013EUP+

MAX3013EUP+

Manufacturer No:

MAX3013EUP+

Description:

IC TRANSLATOR BIDIR 20TSSOP

Datasheet:

Datasheet

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MAX3013EUP+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Features
    Power Supply Decoupling
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    100Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 3.6 V
  • Voltage - VCCA
    1.2 V ~ 3.6 V
  • Channels per Circuit
    8
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The SY10ELT23ZI-TR is a high-performance, low-power integrated circuit chip commonly used in high-speed signal transmission applications. It belongs to the ECLinPS family of devices manufactured by Microchip Technology Inc. Here are some advantages and application scenarios of this particular chip:Advantages: 1. High-speed performance: SY10ELT23ZI-TR supports speeds up to 3.5 GHz, making it suitable for applications requiring fast data transmission. 2. Low power consumption: The chip is designed to operate at low power levels, reducing energy consumption and heat generation. 3. Differential signaling: It employs differential inputs and outputs, which improves noise immunity and provides better signal integrity in noisy environments. 4. Wide supply voltage range: It can operate with a supply voltage ranging from -4.2V to -5.7V, providing flexibility in different power supply configurations.Application Scenarios: 1. High-speed data communications: SY10ELT23ZI-TR is commonly used in high-speed data transmission systems, such as fiber optic networks, Ethernet switches, and routers. 2. Test and measurement equipment: The chip can be used in oscilloscopes, logic analyzers, and other test equipment that require precise and fast signal processing capabilities. 3. Telecommunication systems: It finds applications in telecommunication infrastructure, including base stations, line cards, and optical transceivers. 4. Computer networking: SY10ELT23ZI-TR can be used in network switches, servers, and other network devices that require high-speed and low-power signal transmission. 5. Data storage systems: It can be utilized in storage area networks (SANs), RAID systems, and other data storage devices requiring high-speed interconnectivity.Overall, the SY10ELT23ZI-TR integrated circuit chip offers high-speed performance, low power consumption, and versatility in various applications involving high-speed signal transmission and data communication.
MAX3013EUP+ Relevant information