100390QC
Manufacturer No:
100390QC
Manufacturer:
Description:
IC TRANSLATOR UNIDIR 28PLCC
Datasheet:
Delivery:
Payment:
In Stock : 1564
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100390QC Specifications
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TypeParameter
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Supplier Device Package28-PLCC (11.51x11.51)
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Package / Case28-LCC (J-Lead)
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Mounting TypeSurface Mount
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Features-
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Operating Temperature0°C ~ 85°C (TC)
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Data Rate-
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Output TypeTri-State, Non-Inverted
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Output SignalTTL
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Input SignalECL
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Channels per Circuit6
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Number of Circuits1
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Channel TypeUnidirectional
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Translator TypeMixed Signal
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PackagingBulk
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Product StatusActive
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Series-
The SN74GTLP817DGVR is a type of integrated circuit (IC) chip designed for use in high-speed digital communication systems. Some of the advantages and application scenarios of this chip include:1. High-Speed Data Transmission: The SN74GTLP817DGVR is specifically designed for data rates up to 2.5 Gbps, making it suitable for high-speed communication applications.2. Low Power Consumption: This chip is optimized for low power consumption, making it suitable for applications where power efficiency is crucial.3. Differential Signaling: The chip utilizes differential signaling, which improves noise immunity and reduces signal degradation, ensuring reliable data transmission.4. Voltage Level Shifting: The chip facilitates voltage level shifting between low-voltage systems (such as FPGA, ASICs) and high-voltage systems (such as line drivers and receivers), thereby enabling seamless integration between different voltage domains.5. Integrated ESD Protection: The IC chip incorporates built-in electrostatic discharge (ESD) protection mechanisms, safeguarding against damage due to electrostatic events.Application scenarios for the SN74GTLP817DGVR IC chip include:1. High-Speed Data Communications: The chip can be used in applications involving high-speed data transmission, such as networking equipment, fiber-optic communication systems, and data centers.2. Interface Conversion: It can be employed in systems that require voltage level shifting between different logic families, facilitating smooth communication between devices operating at different voltage levels.3. Signal Integrity Enhancement: The chip's differential signaling capability can be utilized to improve signal integrity in high-speed digital systems, reducing noise and ensuring reliable data transmission.4. PCB Design Simplification: The use of this chip can simplify the PCB design process, as it eliminates the need for complex level shifting circuits and provides integrated ESD protection.Overall, the SN74GTLP817DGVR IC chip is well-suited for high-speed digital communication applications, where high data rates, low power consumption, voltage level shifting, and signal integrity are essential requirements.
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