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MAX3340EEUD

MAX3340EEUD

Manufacturer No:

MAX3340EEUD

Description:

ESD PROTECTED LEVEL TRANSLATOR

Datasheet:

Datasheet

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MAX3340EEUD Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-UCSP (2.02x2.02)
  • Package / Case
    16-WFBGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    12Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.8 V ~ 3.6 V
  • Voltage - VCCA
    4 V ~ 5.5 V
  • Channels per Circuit
    1
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The TXB0104YZTR is a bidirectional voltage-level translator integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TXB0104YZTR chip are:Advantages: 1. Bidirectional Translation: The chip can translate voltage levels in both directions, allowing communication between devices operating at different voltage levels. 2. Automatic Direction Control: It features automatic direction control, eliminating the need for additional control signals. 3. Low Power Consumption: The chip has low power consumption, making it suitable for battery-powered devices. 4. High-Speed Operation: It supports high-speed data transfer, making it suitable for applications requiring fast communication. 5. ESD Protection: The chip provides built-in electrostatic discharge (ESD) protection, safeguarding the connected devices from damage.Application Scenarios: 1. Interfacing Different Logic Families: The TXB0104YZTR chip can be used to interface devices operating at different logic levels, such as connecting a 3.3V microcontroller to a 5V peripheral. 2. Mixed Voltage Systems: It is commonly used in mixed voltage systems, where multiple devices with different voltage requirements need to communicate with each other. 3. I2C and SPI Communication: The chip can be used in I2C and SPI communication interfaces to enable communication between devices operating at different voltage levels. 4. Level Shifting: It can be used for level shifting in various applications, such as connecting sensors or modules with different voltage requirements to a microcontroller. 5. IoT and Wearable Devices: The low power consumption and bidirectional translation capabilities make the chip suitable for IoT and wearable devices, where power efficiency and communication between different voltage domains are crucial.Overall, the TXB0104YZTR chip provides a convenient and efficient solution for voltage-level translation in various electronic systems, enabling seamless communication between devices operating at different voltage levels.
MAX3340EEUD Relevant information