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NLSX0102FCT2G

NLSX0102FCT2G

Manufacturer No:

NLSX0102FCT2G

Manufacturer:

onsemi

Description:

IC TRNSLTR BIDIR 8FLIPCHIP

Datasheet:

Datasheet

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NLSX0102FCT2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-FlipChip
  • Package / Case
    8-XFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    24Mbps
  • Output Type
    Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.5 V ~ 5.5 V
  • Voltage - VCCA
    1.5 V ~ 5.5 V
  • Channels per Circuit
    2
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Last Time Buy
  • Series
    -
The TXS0101DBVT is a bidirectional voltage-level translator integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TXS0101DBVT chip are:Advantages: 1. Bidirectional Translation: The chip can translate voltage levels in both directions, allowing seamless communication between devices operating at different voltage levels. 2. Wide Voltage Range: It supports translation between voltage levels ranging from 1.2V to 3.6V, making it compatible with a wide range of devices. 3. Low Power Consumption: The chip has low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. Small Form Factor: The chip comes in a small package (SOT-23), making it suitable for space-constrained applications or PCB designs.Application Scenarios: 1. Interfacing Different Logic Families: The TXS0101DBVT chip can be used to interface devices operating at different logic voltage levels, such as translating between 3.3V and 5V logic levels. 2. Microcontroller/Peripheral Communication: It can be used to enable communication between microcontrollers and peripherals operating at different voltage levels, ensuring compatibility and reliable data transfer. 3. I2C/SPI Level Translation: The chip can be used to translate voltage levels in I2C or SPI communication buses, allowing devices with different voltage requirements to communicate seamlessly. 4. Sensor Integration: It can be used to interface sensors with microcontrollers or other devices operating at different voltage levels, enabling data acquisition and processing. 5. Mobile Devices: The chip can be used in mobile devices to interface different components, such as translating voltage levels between the application processor and display driver ICs.Overall, the TXS0101DBVT chip's bidirectional voltage-level translation capability, wide voltage range, low power consumption, and small form factor make it a versatile solution for various applications requiring voltage level translation.
NLSX0102FCT2G Relevant information