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LSF0108BQ-Q100X

LSF0108BQ-Q100X

Manufacturer No:

LSF0108BQ-Q100X

Manufacturer:

Nexperia USA Inc.

Description:

IC TRANSLATOR BIDIR 20DHVQFN

Datasheet:

Datasheet

Delivery:

Payment:

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LSF0108BQ-Q100X Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-DHVQFN (4.5x2.5)
  • Package / Case
    20-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Data Rate
    100MHz
  • Output Type
    Open Drain, Push-Pull
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.8 V ~ 5.5 V
  • Voltage - VCCA
    0.95 V ~ 4.5 V
  • Channels per Circuit
    8
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The MAX13032EETE+ is a highly integrated circuit chip designed for automotive applications. Here are some advantages and application scenarios associated with this chip:Advantages: 1. High Integration: The MAX13032EETE+ integrates multiple functions into a single chip, reducing the need for external components and board space. 2. Robust Performance: It is designed to operate in harsh automotive environments, with features like ESD protection and overvoltage/undervoltage protection. 3. Low Power Consumption: The chip is designed for low power operation, making it suitable for battery-powered applications. 4. Diagnostic Features: It includes diagnostic functions for various automotive sensors and outputs, allowing for easy monitoring and troubleshooting. 5. Flexibility: The MAX13032EETE+ supports multiple communication protocols such as I2C, SPI, and LIN, making it versatile for a wide range of automotive applications.Application Scenarios: 1. Body Control Modules: The chip can be used in automotive body control modules to control different functions like lighting, door locks, window controls, and more. 2. Powertrain Systems: It can be utilized for monitoring sensors and controlling actuators in powertrain systems like engine management and fuel injection systems. 3. Safety Systems: The MAX13032EETE+ can be applied in various safety systems such as ABS (Anti-lock Braking System), airbag control, stability control, and tire pressure monitoring. 4. Climate Control: It can be used for controlling and monitoring temperature sensors, fan speed, and other climate control parameters in automotive HVAC (Heating, Ventilation, and Air Conditioning) systems. 5. Instrument Clusters: The chip can be integrated into instrument clusters for displaying important information like speed, fuel level, temperature, and more.It's important to note that the specific applications of the MAX13032EETE+ can vary based on the requirements of the automotive system and the overall architecture.
LSF0108BQ-Q100X Relevant information