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74LVC2T45HK3-7

74LVC2T45HK3-7

Manufacturer No:

74LVC2T45HK3-7

Manufacturer:

Diodes Incorporated

Description:

IC TRANSLATOR BIDIR X2DFN1410-8

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC2T45HK3-7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    X2-DFN1410-8
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Data Rate
    420Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.2 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Channels per Circuit
    2
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The MC100ES60T22EFR2 is a high-speed, low-power integrated circuit chip designed for use in various applications. Some of its advantages and application scenarios include:1. High-speed operation: The chip operates at very high speeds, making it suitable for applications that require fast data processing and transmission.2. Low power consumption: The chip is designed to consume minimal power, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Differential signaling: The chip supports differential signaling, which helps in reducing noise and improving signal integrity, making it suitable for applications that require high-speed data transmission over long distances.4. Clock and data recovery: The chip includes clock and data recovery circuits, which are essential for extracting clock signals and data from high-speed serial data streams. This makes it suitable for applications that involve serial data communication.5. Communication systems: The chip can be used in various communication systems, such as high-speed data links, optical networks, and telecommunications equipment.6. Test and measurement equipment: The chip can be used in test and measurement equipment that requires high-speed data acquisition and processing capabilities.7. Networking equipment: The chip can be used in networking equipment, such as routers and switches, to handle high-speed data traffic and ensure reliable data transmission.8. Industrial automation: The chip can be used in industrial automation systems that require high-speed data processing and communication, such as control systems and robotics.9. Medical imaging: The chip can be used in medical imaging equipment, such as ultrasound machines or MRI scanners, to handle high-speed data acquisition and processing.Overall, the MC100ES60T22EFR2 integrated circuit chip offers high-speed, low-power operation, making it suitable for a wide range of applications that require fast data processing, high-speed data transmission, and reliable signal integrity.
74LVC2T45HK3-7 Relevant information