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MAX13032EETE+

MAX13032EETE+

Manufacturer No:

MAX13032EETE+

Description:

IC TRANSLTR BIDIRECTIONAL 16TQFN

Datasheet:

Datasheet

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MAX13032EETE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (4x4)
  • Package / Case
    16-WQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Features
    Power Supply Decoupling
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    100Mbps
  • Output Type
    Open Drain, Push-Pull
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    2.2 V ~ 3.6 V
  • Voltage - VCCA
    1.62 V ~ 3.2 V
  • Channels per Circuit
    6
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The SN74GTL2003PWR is a high-speed, low-voltage integrated circuit chip designed for translating and bridging signals between different voltage levels. It is commonly used in a variety of application scenarios where voltage level translation and interfacing are required. Some advantages and application scenarios of the SN74GTL2003PWR chip include:Advantages: 1. Wide voltage range: The chip supports translation between multiple voltage levels, making it versatile for a wide range of applications. 2. High-speed operation: It offers fast signal translation with data rates of up to 400 Mbps, making it suitable for high-speed interfaces. 3. Low power consumption: The SN74GTL2003PWR chip is designed to operate at low-voltage levels, consuming minimal power. 4. Small form factor: It comes in a compact package, making it suitable for space-constrained applications.Application Scenarios: 1. I2C and SMBus interface translation: The chip can be used to interface between different voltage levels in I2C and SMBus communication, allowing devices operating at different voltages to communicate effectively. 2. General-purpose voltage level translation: It can be used to translate logic levels between microcontrollers, CPUs, and other digital devices operating at different voltage levels. 3. Memory module interfaces: The chip can be used to interface between memory modules (such as DDR, DDR2, etc.) and memory controllers that operate at different voltage levels. 4. FPGA and ASIC interfacing: It enables interfacing between field-programmable gate arrays (FPGAs) and application-specific integrated circuits (ASICs) that operate at different voltage levels.Overall, the SN74GTL2003PWR chip is widely used for voltage level translation and bridging applications, ensuring seamless communication between devices operating at various voltage levels.
MAX13032EETE+ Relevant information