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MAX3002EUP+T

MAX3002EUP+T

Manufacturer No:

MAX3002EUP+T

Description:

IC TRANSLATOR BIDIR 20TSSOP

Datasheet:

Datasheet

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MAX3002EUP+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing, Power-Supply Decoupling
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    35Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Channels per Circuit
    8
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The ST1G3234BBJR integrated circuit (IC) chips have several advantages and application scenarios:Advantages:1. High-Speed Operation: The IC chips have a high-speed operation capability, making them suitable for applications that require fast data transmission and processing.2. Low Power Consumption: These chips are designed to have low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is essential.3. Small Form Factor: The ST1G3234BBJR chips are packaged in a small form factor, which makes them suitable for space-constrained applications.4. Multi-functionality: The IC chips offer several functions in a single package, allowing for more efficient use of board space and simplification of circuit designs.Application Scenarios:1. Communication Systems: The ST1G3234BBJR chips can be used in various communication systems, including wired and wireless applications. They are commonly used in data communication systems, such as UART (Universal Asynchronous Receiver Transmitter) interfaces, to enable data transmission between different devices.2. Industrial Automation: These IC chips find applications in industrial automation systems, where they are used for signal conditioning, level shifting, and buffering. They help interface different components and devices in complex industrial control systems.3. Consumer Electronics: The ST1G3234BBJR chips are widely used in consumer electronic devices, such as smartphones, tablets, and gaming consoles. They are often used for voltage level shifting, data buffering, and signal conditioning in various interfaces, including USB, HDMI, and DisplayPort.4. Automotive Electronics: The chips can be used in automotive electronics applications, such as vehicle infotainment systems, dashboard displays, and communication interfaces. They help ensure reliable data transmission and signal integrity in harsh automotive environments.5. Internet of Things (IoT) Devices: The low power consumption and small form factor of these IC chips make them suitable for IoT devices. They can be used in sensors, smart home devices, wearable devices, and other IoT applications that require efficient data communication and processing.Overall, the ST1G3234BBJR IC chips offer high-speed operation, low power consumption, small form factor, and multi-functionality, making them suitable for a range of applications in communication systems, industrial automation, consumer electronics, automotive electronics, and IoT devices.
MAX3002EUP+T Relevant information