FXMA2104UMX

FXMA2104UMX

Manufacturer No:

FXMA2104UMX

Manufacturer:

onsemi

Description:

IC TRANSLTR BIDIRECTIONAL 12UMLP

Datasheet:

Datasheet

Delivery:

Payment:

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FXMA2104UMX Specifications

  • Type
    Parameter
  • Supplier Device Package
    12-UMLP (1.8x1.8)
  • Package / Case
    12-UFQFN
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    26MHz
  • Output Type
    Open Drain, Tri-State
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.65 V ~ 5.5 V
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SY100EPT23LKG-TR integrated circuit chip is a differential receiver designed for high-speed data transmission over long distances in digital applications. Some advantages and application scenarios of this chip are as follows:Advantages: 1. High-speed data transmission: The SY100EPT23LKG-TR chip operates at high data rates, making it suitable for applications requiring fast data transfer. 2. Differential signaling: It supports differential signaling, which helps in reducing noise and improving the overall signal quality and integrity. 3. Long-distance transmission: This chip is designed to transmit data over long distances without significant degradation and distortion, making it suitable for applications that require data transmission across large physical distances. 4. Low voltage operation: The SY100EPT23LKG-TR chip operates at low voltage levels, making it compatible with low-voltage systems and reducing power consumption.Application scenarios: 1. Communication systems: The high-speed and long-distance transmission capabilities of this chip make it suitable for various communication systems, including telecommunications, data centers, and networking equipment. 2. Industrial automation: The chip can be used in industrial automation systems that require reliable and fast transmission of digital signals over long distances, such as process control systems and robotics. 3. Test and measurement equipment: It can be used in instruments and equipment used for high-speed data acquisition and analysis, such as oscilloscopes, logic analyzers, and data acquisition systems. 4. High-performance computing: The chip can be utilized in high-performance computing applications where fast and reliable data transfer is critical, such as supercomputers and high-performance servers.Note: It is essential to refer to the manufacturer's datasheet and specifications for detailed information and suitability of the chip for specific applications.