74LVCH2T45GT,115

74LVCH2T45GT,115

Manufacturer No:

74LVCH2T45GT,115

Manufacturer:

Nexperia USA Inc.

Description:

IC TRANSLTR BIDIRECTIONAL 8XSON

Datasheet:

Datasheet

Delivery:

Payment:

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74LVCH2T45GT,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XSON, SOT833-1 (1.95x1)
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Data Rate
    420Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.2 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Channels per Circuit
    2
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVCH
The LSF0102GXX integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. Low power consumption: The LSF0102GXX chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Wide supply voltage range: These chips can operate over a wide range of supply voltages, allowing them to be used in different power supply configurations. 3. High-speed operation: The LSF0102GXX chips are capable of high-speed data transmission, making them suitable for applications that require fast and reliable communication. 4. Small form factor: These chips are available in small package sizes, making them suitable for space-constrained applications and compact electronic devices. 5. ESD protection: The LSF0102GXX chips provide built-in electrostatic discharge (ESD) protection, ensuring the safety and reliability of the connected devices.Application Scenarios: 1. Mobile devices: The low power consumption and small form factor of the LSF0102GXX chips make them ideal for use in smartphones, tablets, and other portable devices that require efficient power management and compact designs. 2. Industrial automation: These chips can be used in industrial automation systems for reliable and high-speed data transmission between sensors, actuators, and control units. 3. Automotive electronics: The LSF0102GXX chips can be applied in automotive electronics for various purposes, such as communication between different modules, sensor interfaces, and control systems. 4. Internet of Things (IoT): With their low power consumption and small size, these chips can be used in IoT devices for wireless communication, sensor interfaces, and energy-efficient operation. 5. Consumer electronics: The LSF0102GXX chips can be utilized in a wide range of consumer electronics, including smart home devices, wearables, gaming consoles, and audio/video equipment, for efficient data transmission and power management.Overall, the LSF0102GXX integrated circuit chips offer advantages such as low power consumption, wide supply voltage range, high-speed operation, small form factor, and ESD protection, making them suitable for various applications in different industries.