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MAX3379EEUD+

MAX3379EEUD+

Manufacturer No:

MAX3379EEUD+

Description:

IC TRANSLATOR UNIDIR 14TSSOP

Datasheet:

Datasheet

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MAX3379EEUD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Features
    Power Supply Decoupling, Thermal-Shutdown Protection
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    16Mbps
  • Output Type
    Open Drain, Tri-State
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The FXM2IC102L8X_F113 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Power Amplification: These chips are designed for high power amplification applications, providing a high output power capability. 2. Wide Frequency Range: They operate over a wide frequency range, making them suitable for various applications. 3. High Efficiency: These chips offer high efficiency, ensuring optimal power usage and minimizing energy wastage. 4. Compact Size: The chips are compact in size, allowing for easy integration into different electronic devices and systems. 5. Low Distortion: They provide low distortion output, ensuring high-quality audio or signal transmission.Application Scenarios: 1. Audio Amplifiers: The FXM2IC102L8X_F113 chips can be used in audio amplifiers to enhance the power and quality of audio signals. 2. RF Power Amplifiers: These chips are suitable for RF power amplification applications, such as in wireless communication systems or radio transmitters. 3. Radar Systems: They can be utilized in radar systems for amplifying radar signals and improving their range and accuracy. 4. Industrial Applications: The chips can be employed in various industrial applications that require high power amplification, such as in industrial automation or control systems. 5. Broadcasting Equipment: They can be used in broadcasting equipment, such as TV or radio transmitters, to amplify the signals for transmission.Overall, the FXM2IC102L8X_F113 integrated circuit chips offer high power amplification, wide frequency range, and high efficiency, making them suitable for various applications that require amplification of signals or audio.
MAX3379EEUD+ Relevant information