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MAX13047EEVB+T

MAX13047EEVB+T

Manufacturer No:

MAX13047EEVB+T

Description:

IC TRANSLATOR BIDIR 10UTQFN

Datasheet:

Datasheet

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MAX13047EEVB+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-UTQFN (1.4x1.8)
  • Package / Case
    10-UFQFN
  • Mounting Type
    Surface Mount
  • Features
    Thermal-Shutdown Protection
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    16Mbps
  • Output Type
    Push-Pull
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.1 V ~ 3.6 V
  • Channels per Circuit
    2
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 74AVCAH164245ZRDR is a specific model of integrated circuit chip, belonging to the 74AVC series, which is known for its high-performance and low-power features. Here are some advantages and application scenarios of the 74AVCAH164245ZRDR chip:Advantages: 1. High-performance: This chip offers high-speed operation, making it suitable for applications requiring fast data transfer and processing. 2. Low power consumption: The 74AVCAH164245ZRDR chip is designed to be energy-efficient, resulting in reduced power consumption and longer battery life in portable devices. 3. Voltage compatibility: It can operate at different voltage levels, making it compatible with various logic standards and allowing seamless integration with different systems. 4. Bidirectional level shifting: The chip supports bidirectional voltage level shifting, enabling data transfer between systems operating at different voltage levels without the need for additional level shifting components. 5. Robust protection features: It incorporates measures to protect against excessive current flow, which safeguards the chip and connected systems.Application scenarios: 1. Data communication systems: The 74AVCAH164245ZRDR chip can be used in data communication applications that require fast and reliable data transfer between different voltage domains, such as routers, switches, and network interfaces. 2. Embedded systems: It is suitable for use in embedded systems that require voltage level shifting, such as automotive electronics, industrial automation, and consumer electronics. 3. IoT devices: This chip can be used in Internet of Things (IoT) applications where communication between low-voltage sensors and higher-voltage control systems is required. 4. Mobile devices: The low power consumption and high-performance characteristics make it suitable for mobile devices, including smartphones, tablets, and wearable technology, where efficient power usage and fast data transfer are crucial. 5. Test and measurement equipment: The chip can be utilized in test and measurement equipment that requires bidirectional voltage level shifting to interface with different voltage signal sources or measurement points.Note: It is always recommended to refer to the datasheet and consult with component manufacturers for specific details and precise application requirements.
MAX13047EEVB+T Relevant information