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MAX3390EEUD+

MAX3390EEUD+

Manufacturer No:

MAX3390EEUD+

Description:

IC TRANSLATOR UNIDIR 14TSSOP

Datasheet:

Datasheet

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MAX3390EEUD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Features
    Power Supply Decoupling, Thermal-Shutdown Protection
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    16Mbps
  • Output Type
    Open Drain, Tri-State
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 5.5 V
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The 74AXP2T45GXX is a specific integrated circuit chip, and its advantages and application scenarios can be described as follows:Advantages: 1. Low-voltage operation: The chip operates at a low voltage range, typically between 1.2V and 3.6V. This makes it suitable for low-power applications and battery-operated devices. 2. Wide voltage supply range: The chip can tolerate a wide voltage supply range, typically between 1.65V and 3.6V. This flexibility allows it to work with a variety of power sources. 3. Bidirectional level shifting: The chip provides voltage level shifting capability, allowing bidirectional communication between devices operating at different voltage levels. 4. Small package size: The chip is available in compact packages like VSSOP, making it suitable for space-constrained applications where board real estate is limited.Application scenarios: 1. Digital signal level shifting: The 74AXP2T45GXX chip can be used to interface between devices with different logic voltage levels. For example, it can be used to convert between 3.3V and 1.8V logic levels. 2. Battery-powered devices: Due to its low-voltage operation and ability to work with a wide range of power sources, the chip can be utilized in battery-powered devices such as wearables, mobile phones, or sensor nodes. 3. IoT applications: The chip's small package size and low-power characteristics make it suitable for use in Internet of Things (IoT) devices, where space and power efficiency are crucial. 4. Mixed signal designs: The 74AXP2T45GXX can also be used in applications where both digital and analog signals need to be processed or switched. It can provide level shifting capabilities while maintaining signal integrity. 5. Industrial control systems: The chip's characteristics make it suitable for use in various industrial control systems, where it can handle different voltage levels and interface with a wide range of sensors and actuators.It's important to note that the specific use cases and advantages of the 74AXP2T45GXX chip may vary depending on the requirements and specifications of a particular project or application. Therefore, it is recommended to consult the chip's datasheet and application notes for detailed information and guidelines.
MAX3390EEUD+ Relevant information