TXB0106PWR

TXB0106PWR

Manufacturer No:

TXB0106PWR

Manufacturer:

Texas Instruments

Description:

IC TRANSLATOR BIDIR 16TSSOP

Datasheet:

Datasheet

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TXB0106PWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    100Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.65 V ~ 5.5 V
  • Voltage - VCCA
    1.2 V ~ 3.6 V
  • Channels per Circuit
    6
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MAX13058EETI+ is a high-speed, low-power, and low-voltage integrated circuit chip designed for use in various applications. Some of the advantages and application scenarios of this chip are:Advantages: 1. High-Speed Operation: The MAX13058EETI+ supports high-speed data rates up to 2Mbps, making it suitable for applications that require fast data transfer.2. Low Power Consumption: This chip is designed to operate at low power, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Low-Voltage Operation: The MAX13058EETI+ operates at low voltage levels, typically between 1.8V and 3.6V, making it compatible with a wide range of devices and systems.4. Robust Communication: It supports a wide range of communication protocols, including SPI, I2C, and UART, enabling seamless integration with various microcontrollers and other devices.5. Small Form Factor: The chip comes in a compact package, allowing for easy integration into space-constrained applications.Application Scenarios: 1. Industrial Automation: The MAX13058EETI+ can be used in industrial automation systems for communication between sensors, actuators, and control units. Its high-speed operation and low power consumption make it suitable for real-time data acquisition and control applications.2. Internet of Things (IoT): With its low power consumption and small form factor, this chip can be used in IoT devices for wireless communication, sensor data acquisition, and control. It can enable efficient and reliable communication between IoT devices and gateways.3. Consumer Electronics: The MAX13058EETI+ can be used in various consumer electronic devices, such as smartphones, tablets, and wearables, for communication between different components and peripherals. Its high-speed operation and low power consumption make it suitable for applications that require fast and efficient data transfer.4. Automotive Electronics: This chip can be used in automotive electronics for communication between different modules and components, such as sensors, actuators, and control units. Its robust communication capabilities and low-voltage operation make it suitable for automotive applications.5. Medical Devices: The MAX13058EETI+ can be used in medical devices for communication between different sensors, monitors, and control units. Its low power consumption and small form factor make it suitable for portable and battery-powered medical devices.Overall, the MAX13058EETI+ integrated circuit chip offers high-speed, low-power, and low-voltage communication capabilities, making it suitable for a wide range of applications in various industries.