SN74AVC4T774RSVR

SN74AVC4T774RSVR

Manufacturer No:

SN74AVC4T774RSVR

Manufacturer:

Texas Instruments

Description:

IC TRANSLTR BIDIRECTIONAL 16UQFN

Datasheet:

Datasheet

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SN74AVC4T774RSVR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-UQFN (2.6x1.8)
  • Package / Case
    16-UFQFN
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    380Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.1 V ~ 3.6 V
  • Voltage - VCCA
    1.1 V ~ 3.6 V
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AVC
The 74LVCH2T45DC-Q100125 is a dual bit, dual supply, bus transceiver integrated circuit chip. Some advantages and application scenarios of this chip are:Advantages:1. Dual supply voltage capability: The chip can be operated with two different supply voltages, which provides flexibility in connecting and interfacing systems with different voltage levels. 2. Wide operating voltage range: The chip can operate within a wide voltage range, typically between 1.2V to 3.6V. This makes it suitable for various low power applications. 3. Bidirectional level shifting: The chip can perform level shifting between two different voltage domains, enabling communication between systems with different voltage levels. 4. High-speed data transmission: The chip supports high-speed data transmission up to 400Mbps, making it suitable for applications requiring fast data transfer. 5. ESD protection: The chip provides built-in electrostatic discharge (ESD) protection, which helps protect against ESD events and increases reliability.Application scenarios:1. Voltage level translation: The chip can be used to interface between two systems with different voltage levels, such as between a microcontroller and a sensor. 2. Bus communication: The chip is commonly used for bidirectional communication between two buses with different voltage levels, such as in I2C, SPI, or UART interfaces. 3. Portable devices: The chip's low power consumption and wide operating voltage range make it suitable for use in battery-powered portable devices such as smartphones, tablets, and wearables. 4. Industrial automation: The chip's fast data transmission capability and ESD protection make it suitable for use in industrial automation applications where reliable and high-speed communication between different subsystems is required. 5. Automotive electronics: The chip's qualification to automotive standards (Q100 grade) makes it suitable for use in automotive electronics, such as in-vehicle networking, infotainment systems, or automotive sensors.