NTS0104GU12,115

NTS0104GU12,115

Manufacturer No:

NTS0104GU12,115

Manufacturer:

NXP USA Inc.

Description:

IC TRANSLTR BIDIRECTIONAL 12XQFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

NTS0104GU12,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    12-XQFN (2x1.7)
  • Package / Case
    12-XFQFN
  • Mounting Type
    Surface Mount
  • Features
    Auto-Direction Sensing
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Data Rate
    50Mbps
  • Output Type
    Open Drain, Push-Pull
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    2.3 V ~ 5.5 V
  • Voltage - VCCA
    1.65 V ~ 3.6 V
  • Channels per Circuit
    4
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SY89327LMI-TR is a specific integrated circuit chip, and its advantages and application scenarios can be summarized as follows:Advantages: 1. High-speed data transmission: The SY89327LMI-TR chip is designed for high-speed data transmission applications, supporting data rates up to 3.2 Gbps. This makes it suitable for applications that require fast and reliable data transfer.2. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The SY89327LMI-TR chip is available in a small form factor, which makes it suitable for applications with limited space or where miniaturization is required.4. Wide operating temperature range: The chip is designed to operate within a wide temperature range, making it suitable for applications that require operation in extreme temperature conditions.Application Scenarios: 1. High-speed communication systems: The SY89327LMI-TR chip can be used in high-speed communication systems such as fiber optic networks, Ethernet switches, or high-speed serial data links. Its high data rate capability and low power consumption make it suitable for these applications.2. Data storage systems: The chip can be used in data storage systems such as solid-state drives (SSDs) or RAID controllers, where fast and reliable data transfer is essential. Its small form factor and low power consumption make it suitable for integration into these systems.3. Industrial automation: The SY89327LMI-TR chip can be used in industrial automation applications that require high-speed data transmission, such as industrial control systems, robotics, or machine vision systems. Its wide operating temperature range makes it suitable for use in harsh industrial environments.4. Medical devices: The chip can be used in medical devices that require high-speed data transfer, such as medical imaging systems or patient monitoring devices. Its low power consumption and small form factor make it suitable for integration into portable or wearable medical devices.Overall, the SY89327LMI-TR integrated circuit chip offers high-speed data transmission, low power consumption, small form factor, and wide operating temperature range, making it suitable for various applications that require fast and reliable data transfer.