SN74AVC1T45DCKR

SN74AVC1T45DCKR

Manufacturer No:

SN74AVC1T45DCKR

Manufacturer:

Texas Instruments

Description:

IC TRANSLTR BIDIRECTIONAL SC70-6

Datasheet:

Datasheet

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SN74AVC1T45DCKR Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-6
  • Package / Case
    6-TSSOP, SC-88, SOT-363
  • Mounting Type
    Surface Mount
  • Features
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Data Rate
    500Mbps
  • Output Type
    Tri-State, Non-Inverted
  • Output Signal
    -
  • Input Signal
    -
  • Voltage - VCCB
    1.2 V ~ 3.6 V
  • Voltage - VCCA
    1.2 V ~ 3.6 V
  • Channels per Circuit
    1
  • Number of Circuits
    1
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AVC
The SN74LXC8T245RHLR is an integrated circuit chip belonging to the SN74LXC series of bus transceivers with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. Bidirectional Communication: The chip supports bidirectional data transfer, allowing data to be sent and received on a common bus. 2. Voltage Level Shifting: It provides level shifting functionality, enabling communication between devices operating at different voltage levels. 3. 3-State Outputs: The 3-state outputs allow the chip to be easily connected to a shared bus, where multiple devices can take turns transmitting data. 4. High-Speed Data Transfer: The chip supports high-speed data transfer, making it suitable for applications requiring quick communication.Application Scenarios: 1. Communication Interfaces: The SN74LXC8T245RHLR can be used in various communication interfaces like UART, SPI, I2C, etc., for level shifting and bidirectional data transfer between devices. 2. Mixed Voltage Systems: When working with mixed voltage systems, the chip can be used to safely interface between devices operating at different voltage levels, ensuring proper and reliable communication. 3. Bus Systems: It is often employed in bus systems where multiple devices share a common data bus. The 3-state outputs allow individual devices to control the bus and avoid conflicts during data transmissions. 4. Data Acquisition Systems: The chip can be used in data acquisition systems, where it aids in transferring analog or digital data between sensors, signal conditioners, and data processing units.It is worth noting that the specific advantages and application scenarios can vary depending on the system requirements and other contextual factors.